This paper presents the newly developed grinding apparatus to fabricate microcylindrical parts made of ceramic material. Two major problems are encountered in the fabrication of miniature parts: firstly, the extremely small geometrical scale in the micrometre range and, secondly, the hard-to-machine ceramic materials. In order to machine such microcylindrical parts, a precision grinding apparatus has been developed. The novelty of this apparatus is adopted from dicing technology used in silicon wafers. The surface topology and ductility of the ground microcylindrical parts are presented.
KomanduriR.LuccaD. A.TaniY.Technological advances in fine abrasive processes. Ann. CIRP, 1997, 46(2), 545–596.
2.
MasuzawaT.TnshoffH. K.Three-dimensional micromachining by machine tools. Ann. CIRP, 1997, 46(2), 621–628.
3.
KubelE.Manufacturing advances at NAMRC XXVI. Mfg Engng, 1998, 121(1), 114–125.
4.
BifanoT. G.DowT. A.ScatergoodR. O.Ductile-regime grinding of brittle materials: Experimental results and the development of a model. In Advances in Fabrication and Metrology for Optics and Large Optics, 1988, Vol. 966, pp. 108–115 (SPIE, Bellingham, Washington).
5.
SlocumA. H.Precision Machine Design, 1992 (Prentice-Hall, Englewood Cliffs, New Jersey).
6.
ArnoneM.Learning the discipline of precision machining, Part 1: Machine tool construction, motion control. Mfg Engng., 1997, 118(6), 58–66.
7.
BalonS. A. P.Development of a novel precision grinding technique for micro-parts. Master thesis, Nanyang Technological University, Singapore, 1999.
8.
ShawM. C.Precision finishing. Ann. CIRP, 1995, 44(1), 343–348.
