Thermodynamic model of reactive sputtering process

Abstract

A new approach in describing the reactive sputtering process is developed by applying a mass balance and the first and second laws of thermodynamics. The developed model involves macroparameters versus microparameters involved in the widely accepted model of Berg et al. The hysteresis loop produced during the PVD process is explained using this new approach. The numerical simulations of the Ti reactive sputtering process in the presence of N₂ and the Al reactive sputtering process in the presence of O₂ in an Ar atmosphere are performed, and the results are compared to the experimental data reported in the literature.