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Abstract

Pulse electrochemical mechanical polishing (PECMP) technology is a compound polishing technology by combining the mechanical action of a traditional grinding process and the electrochemical reaction of a pulse electrochemical machining (PECM) like process. Its advantages are low surface roughness, high efficiency, simple equipment, low material removal and more applications. Because a number of processing input variables (voltage activation program, electrolyte composition, etc.) will influence the surface quality of workpiece and productivity, controlling the surface reactions in PECMP requires a carefully designed combination of various processing parameters. In the present work, several typical experiments are investigated to compare the properties of PECMP with that of electrochemical mechanical polishing (ECMP). The experimental results can contribute to optimisation of the processing parameters of PECMP. Analytic methodology for the workpiece surface quality after PECMP is helpful to conduct the processing parameters as well. By comparison, PECMP is proved to be more efficient and have better surface quality than ECMP.

Keywords

PULSE ELECTROCHEMICAL MECHANICAL POLISHING ECMP SURFACE QUALITY PRODUCTIVITY

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References

P. S.

: J. Mater. Process. Technol., 2007, 192-193, 470–477.

Guo

Z. N.

, Leeb

T. C.

, Yue

T. M.

and Lau

W. S.

: J. Mater. Process. Technol., 2000, 102, (1-3), 122–127.

Goonetilleke

P. C.

and Roy

: J. Magn. Magn. Mater., 2008, 320, (22), 3104–3107.

Seo

Y.-J.

, Kim

N.-H.

and Lee

W.-S.

: Mater. Lett., 2006, 60, (9-10), 1192–1197.

Goonetilleke

P. C.

and Roy

: Mater. Chem. Phys., 2005, 94, (2-3), 388–400.

Emery

S. B.

, Hubbley

J. L.

, Darling

M. A.

and Roy

: Mater. Chem. Phys., 2005, 89, (2-3), 345–353.

Lee

S.-J.

, Lee

Y.-M.

and Du

M.-F.

: J. Mater. Process. Technol., 2003, 140, (1-3), 280–286.

Rajurkar

K. P.

, Zhu

, McGeough

J. A.

, Kozak

and Desila

: Ann. CIRP, 1999, 48, (2), 567–579.

Tam

, Loh

N. L.

, Mah

C. P. A.

and Loh

N. H.

: J. Mater. Process. Technol, 1992, 35, (1), 83–91.

10.

Shattuck

K. G.

, Lin

J.-Y.

, Cojocaru

and West

A. C.

: Electrochim. Acta, 2008, 53, (28), 8211–8216.

11.

Zhou

J. J.

, Pang

G. B.

, Wang

and Xu

W. J.

: Int. J. Manuf Technol. Manage., 2005, 7, (2-4), 352–365.

12.

, Zhang

and Xu

: Autom. Mater. Technol., 1999, 11, (3), 21–23.

13.

B.-Z.

and Zhou

J.-J.

: J. Zhejiang Univ., Sci A, 2005, 6A, (10), 1152–1157.

14.

Zheng

J., J.

, Yang

and Xia

: Int. J. Adv. Manuf Technol, 2002, 19, (1), 8–13.

15.

J. J.

, Guan

Y. F.

, Ji

B. Y.

, Yu

and Dong

J. X.

: Int. J. Precis. Eng. Manuf, 2007, 8, (4), 27–32.

16.

Zhizhao

, Lianwen

, Jingjing

and Younian

: Electr. Machin., 1999, 5, (4), 22–26.

17.

, Ming

and Xu

: Autom. Technol., 1997, 10, (12), 44–46.

18.

: ‘Research on the theory of automotive gear modification and new technology of its electrochemical modification based on intelligent control’, PhD dissertation, Dalian University of Technology, Dalian, China, 1999.

19.

X. G.

and Shong

: Electro Machin., 2002, (2), 13–15.

20.

Zhao

X. S.

: ‘The combined electrochemical mechanical polishing and pulse current electrochemical polishing’, MSc thesis, Hefei University of Technology, Hefei, China, 2000.

21.

Yamaguchi

, Shinmura

and Kobayashi

: JSME Mt. J. C, 2001, 44C, (1), 275–281.

22.

Ramasawmy

and Blunt

: Int. J. Mach. Tools Manuf, 2002,42, 567–574.

23.

Goonetilleke

P. C.

and Roy

: Mater. Chem. Phys., 2005, 94, (2-3), 388–400.

Basic experimental investigation of pulsed electrochemical mechanical polishing process

Abstract

Keywords

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