Thermo-hydraulic performance of solid/porous compound wavy microchannel heat sink with various angle of slanted passage

Abstract

Microchannel-based heat sink is used to transfer huge amount of heat from electronics devices since last four decades, which is one of the best heat exchanger so far. In this study, a solid porous compound wavy microchannel heat sink (MCHS) with different angles of slanted passage has been evaluated with the help of commercial ANSYS fluent software at Reynolds number of 50 to 300 and compared with sinusoidal channel heat sink (SCHS). Fluid flow through porous fins is solved by Darcy–Forchheimer flow models and the thermo-hydraulic performance of MCHS is solved using finite volume approach. The walls and fins are made of copper, and the operating fluid is pure water. The impacts on secondary flow slanted passage with different angles (e.g. 30D, 45D, 60D, 75D, and 90D) in compound wavy channels are scrutinized. It is observed that as the slanted passage angle decreases in the compound wavy channel, heat transfer performance is significantly enhanced as well as pressure drop penalty decreases when compared to the SCHS. This is due to the increased effective fluid mixing by the dean vortices through secondary flow slanted passage at the crest and trough as well as permeation effect on the porous zone. The highest performance factor of 102.19% is calculated for solid/porous compound wavy microchannel heat sink (CWMC) 30D slanted passage heat sink at Reynolds number of 150. Hence, CWMC heat sink with secondary flow slanted passage have an ability to improve the cooling rate of microelectronics components.