The precise manipulation of surface morphology and roughness at the nanoscale level is crucial for various engineering applications. This study presents the superimposed reverse diamond turning (SRDT) technique for polycrystalline copper, aiming to achieve exceptionally small surface roughness. Through molecular dynamics simulations and experimental verification using ultra-precision diamond turning, the nanoscale cutting process and its effects on the surface quality of polycrystalline copper are analyzed. Molecular dynamics simulations reveal detailed insights into cutting morphology, grain distribution, and cutting forces, providing a fundamental understanding of material behavior during the cutting process. Experimental validation using diamond turning experiments corroborates the simulation results, demonstrating the effectiveness of superimposed reverse feeding in reducing surface roughness and improving surface finish. The SRDT technique has been shown to significantly reduce surface roughness in polycrystalline copper, with a 30% decrease and average roughness values reaching as low as 1.25 nm. This demonstrates the potential of SRDT to enhance precision machining techniques, contributing to the advancement of ultra-precision manufacturing processes.
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