Pyrolysis treatment of nonmetal fraction of waste printed circuit boards: Focusing on the fate of bromine

Abstract

Advanced thermal treatment of electronic waste offers advantages of volume reduction and energy recovery. In this work, the pyrolysis behaviour of nonmetallic fractions of waste printed circuit boards was studied. The fate of a bromine and thermal decomposition pathway of nonmetallic fractions of waste printed circuit boards were further probed. The thermogravimetric analysis showed that the temperatures of maximum mass loss were located at 319°C and 361°C, with mass loss of 29.6% and 50.6%, respectively. The Fourier transform infrared Spectroscopy analysis revealed that the spectra at temperatures of 300°C–400°C were complicated with larger absorbance intensity. The nonmetallic fractions of waste printed circuit boards decomposed drastically and more evolved products were detected in the temperature range of 600°C–1000°C. The gas chromatography–mass spectrometry analysis indicated that various brominated derivates were generated in addition to small molecules, such as CH₄, H₂O and CO. The release intensity of CH₄ and H₂O increased with temperature increasing and reached maximum at 600°C–800°C and 400°C–600°C. More bromoethane (C₂H₅Br) was formed as compared with HBr and methyl bromide (CH₃Br). The release intensity of bromopropane (C₃H₇Br) and bromoacetone (C₃H₅BrO) were comparable, although smaller than that of bromopropene (C₃H₅Br). More dibromophenol (C₆H₄Br₂O) was released than that of bromophenol (C₆H₅BrO) in the thermal treatment. During the thermal process, part of the ether bonds first ruptured forming bisphenol A, propyl alcohol and tetrabromobisphenol A. Then, the tetrabromobisphenol A decomposed into C₆H₅BrO and HBr, which further reacted with small molecules forming brominated derivates. It implied debromination of raw nonmetallic fractions of waste printed circuit boards or pyrolysis products should be applied for its environmentally sound treating.