The type of organic additives significantly affects copper electropolishing performance, including glossiness and surface smoothness. Therefore, developing efficient and eco-friendly additives is crucial for advancing this technology. This study investigates the effects of glycerol and ascorbic acid on copper electrochemical properties and surface morphology. Using the Box- Behnken Design (BBD), we examined the interaction effects of polishing time (A), current density (B), and polishing temperature (C) while optimizing the process parameters. The results demonstrate that glycerol and ascorbic acid additives effectively reduce the critical current density and limiting current density, synergistically enhancing copper surface glossiness and smoothness while slowing down the dissolution rate of the copper. Interaction analysis revealed a prioritized sequence of effects: AB > BC > AC. Under optimal conditions (1.5 min of polishing time, 12 A dm−2 of current density, and 27 °C of polishing temperature), copper surface roughness decreases from 1.2 μm to 37 nm, representing a 97% reduction, along with enhanced corrosion resistance.
ElshkakiAGraedelTECiacciL,et al.Copper demand, supply, and associated energy use to 2050. Glob Environ Change2016; 39: 305–315.
2.
WuDKangRNiuL, et al.Two-Step electrochemical mechanical polishing of pure copper. ECS J Solid State Sci Technol2019; 8: P699–P703.
3.
PanBKangRGuoJ, et al.Precision fabrication of thin copper substrate by double-sided lapping and chemical mechanical polishing. J Manuf Processes2019; 44: 47–54.
4.
KitykAADanilovFIProtsenkoVS, et al.Electropolishing of two kinds of bronze in a deep eutectic solvent (Ethaline). Surf Coat Technol2020; 397: 126060.
5.
MinRWangLChengY,et al.Dry electrochemical polishing of copper alloy in a medium containing ion-exchange resin. RSC Adv2021; 11: 35898–35909.
6.
LiuDZhangZFengJ, et al.Environment-friendly chemical mechanical polishing for copper with atomic surface confirmed by transmission electron microscopy. Colloids Surf A: Physicochem Eng Asp2023; 656: 130500.
7.
ZhangZCuiJZhangJ, et al.Environment friendly chemical mechanical polishing of copper. Appl Surf Sci2019; 467–468: 5–11.
8.
HuoJSolankiRMcAndrewJ. Electrochemical polishing of copper for microelectronic applications. Surf Eng2003; 19: 11–16.
9.
KhanDAJhaS. Synthesis of polishing fluid and novel approach for nanofinishing of copper using ball-end magnetorheological finishing process. Mater Manuf Processes2018; 33: 1150–1159.
10.
HanWFangF. Fundamental aspects and recent developments in electropolishing. Int J Mach Tools Manuf2019; 139: 1–23.
11.
Łyczkowska-WidłakELochyńskiPNawratG. Electrochemical polishing of austenitic stainless steels. Materials2020; 13: 2557.
12.
KimJParkJKKimHK, et al.Optimization of electropolishing on NiTi alloy stents and its influence on corrosion behavior. J Nanosci Nanotechnol2017; 17: 2333–2339.
13.
RuiMLishiWYihangC,et al.Dry electrochemical polishing of copper alloy in a medium containing ion-exchange resin. RSC Adv2021; 11: 35898–35909.
14.
YangGWangBTawfiqK, et al.Electropolishing of surfaces: theory and applications. Surf Eng2017; 33: 149–166.
15.
XuYZhiHLiG,et al.The application of anodic polarization curves of CuSn alloy contact wire in electro-polishing. Mater Dev Appl2009; 24: 32–35.
16.
AwadAMGhanyNAADahyTM. Removal of tarnishing and roughness of copper surface by electropolishing treatment. Appl Surf Sci2010; 256: 4370–4375.
17.
KwonGDKimYWMoyenE, et al.Controlled electropolishing of copper foils at elevated temperature. Appl Surf Sci2014; 307: 731–735.
18.
LiuMMengYZhaoY, et al.Electropolishing parameters optimization for enhanced performance of nickel coating electroplated on mild steel. Surf Coat Technol2016; 286: 285–292.
19.
TahaAAShabanSMFetouhHA, et al.Synthesis and evaluation of nonionic surfactants based on dimethylaminoethylamine: electrochemical investigation and theoretical modeling as inhibitors during electropolishing in-ortho-phosphoric acid. J Mol Liq2021; 328: 115421.
20.
JiangLLiQChenY, et al.Polyacrylic acid as a lubricant and a complement to 1,2,4-triazole for copper chemical mechanical polishing. Tribol Lett2023; 71: 62.
21.
BianY-fZhaiW-jChengY-y, et al.Electrolyte composition and removal mechanism of Cu electrochemical mechanical polishing. J Cent South Univ2014; 21: 2191–2201.
22.
WangYZhangSTanB, et al.Effect of corrosion inhibitor BTA on silica particles and their adsorption on copper surface in copper interconnection CMP. ECS J Solid State Sci Technol2022; 11: 044002.
23.
BrixiNKSailLBezzarA. Application of ascorbic acid as green corrosion inhibitor of reinforced steel in concrete pore solutions contaminated with chlorides. J Adhes Sci Technol2022; 36: 1176–1199.
24.
ArgizCArroyoCBravoA, et al.L-Ascorbic acid as an efficient green corrosion inhibitor of steel rebars in chloride contaminated cement mortar. Materials (Basel)2022; 15.
25.
FatmaMA. A study of the morphology and optical properties of electro polished steel in the presence of Vitamin-C. Afr J Pure Appl Chem2015; 9: 135–145.
26.
JianYRiPFanJ, et al.Optimization of magnetic composite fluid polishing process based on response surface method. J Chin Inst Eng2022; 45: 35–41.
27.
XieYChangGYangJ, et al.Process optimization of robotic polishing for mold steel based on response surface method. Machines2022; 10: 283.
28.
ZhaoTShiYLinX, et al.Surface roughness prediction and parameters optimization in grinding and polishing process for IBR of aero-engine. Int J Adv Manuf Technol2014; 74: 653–663.
29.
FerreiraSLBrunsREFerreiraHS, et al.Box-Behnken design: an alternative for the optimization of analytical methods. Anal Chim Acta2007; 597: 179–186.
30.
LuisBEyhabAAhmedJ, et al.Optimization by Box–Behnken design for environmental contaminants removal using magnetic nanocomposite. Sci Rep2024; 14.
31.
ZhuQQLiHYWangY, et al.Low current density electropolishing and corrosion resistance study of 304 stainless steel. Surf Eng2024.
32.
SwamyGJSangamithraAChandrasekarV. Response surface modeling and process optimization of aqueous extraction of natural pigments from Beta vulgaris using Box–Behnken design of experiments. Dyes Pigments2014; 111: 64–74.
33.
KumarSSBishnoiNR. Coagulation of landfill leachate by FeCl3: process optimization using Box–Behnken design (RSM). Appl Water Sci2017; 7: 1943–1953.
34.
KumarNSinhaSMehrotraT, et al.Biodecolorization of azo dye Acid Black 24 by Bacillus pseudomycoides: Process optimization using Box Behnken design model and toxicity assessment. Bioresour Technol Rep2019; 8: 100311.
35.
TahaAAAhmedAMRahmanHHA,et al.The effect of surfactants on the electropolishing behavior of copper in orthophosphoric acid. Appl Surf Sci2013; 277: 155–166.
36.
HanWFangF. Investigation of electrochemical properties of electropolishing Co–Cr dental alloy. J Appl Electrochem2020; 50: 367–381.
Chi-UcánSLCastillo-AtocheACastro BorgesP, et al.Inhibition effect of glycerol on the corrosion of copper in NaCl solutions at different pH values. J Chem2014; 2014: 1–10.
39.
TahaAA. Study of the effect of ethylene glycol and glycerol on the rate of electropolishing of copper by the rotating disk technique. Anti-Corros Methods Mater2000; 47: 94–104.
40.
PalcutMGerhátovᎊulhánekP,et al.Corrosion resistance of steel S355MC in crude glycerol. Technologies2023; 11: 69.
41.
JinYWuYCaoJ,et al.Optimizing decolorization of Methylene Blue and Methyl Orange dye by pulsed discharged plasma in water using response surface methodology. J Taiwan Inst Chem Eng2014; 45: 589–595.
42.
BragaARCGomesPAKalilSJ. Formulation of culture medium with agroindustrial waste for β-galactosidase production from Kluyveromyces marxianus ATCC 16045. Food Bioprocess Technol2012; 5: 1653–1663.
43.
PetrovićSRožićLJovićV, et al.Optimization of a nanoparticle ball milling process parameters using the response surface method. Adv Powder Technol2018; 29: 2129–2139.
44.
Abu AmrSSAzizHABashirMJK. Application of response surface methodology (RSM) for optimization of semi-aerobic landfill leachate treatment using ozone. Appl Water Sci2014; 4: 231–239.
45.
ChenY-DChenW-QHuangB,et al.Process optimization of K2C2O4-activated carbon from kenaf core using Box–Behnken design. Chem Eng Res Design2013; 91: 1783–1789.
46.
NoordinMYVenkateshVCSharifS, et al.Application of response surface methodology in describing the performance of coated carbide tools when turning AISI 1045 steel. J Mater Process Technol2004; 145: 46–58.
47.
BehbahaniMMoghaddamMRAAramiM. Techno-economical evaluation of fluoride removal by electrocoagulation process: optimization through response surface methodology. Desalination2011; 271: 209–218.
48.
MäkeläM. Experimental design and response surface methodology in energy applications: a tutorial review. Energy Convers Manag2017; 151: 630–640.
49.
KoushaMDaneshvarESohrabiMS, et al.Optimization of C.I. Acid black 1 biosorption by Cystoseira indica and Gracilaria persica biomasses from aqueous solutions. Int Biodeter Biodegr2012; 67: 56–63.
50.
GargKKPrasadB. Development of Box Behnken design for treatment of terephthalic acid wastewater by electrocoagulation process: optimization of process and analysis of sludge. J Environ Chem Eng2016; 4: 178–190.
51.
ZhuDChenQQiuT, et al.Optimization of rare earth carbonate reactive-crystallization process based on response surface method. J Rare Earths2021; 39: 98–104.
52.
GuoyongRWenruiTHongzhouD, et al.Comparative statistical analysis of pitting in Two 2205 duplex stainless steel variants. NPJ Mater Degr2024; 8.
53.
ZhangBMinZYongfengY, et al.Comparing the corrosion behavior of CoCrNi medium-entropy alloy and duplex stainless steel in ammonium chloride solution. J Mater Eng Perform2024.
54.
JoaquínYFerrariBAntonio JavierS-H,et al.Understanding the effects of different microstructural contributions in the electrochemical response of Nickel-based semiconductor electrodes with 3D hierarchical networks shapes. Electrochim Acta2020; 335: 135629.
55.
WeiHFengzhouF. Electropolishing of 316L stainless steel using sulfuric acid-free electrolyte. J Manuf Sci Eng-Trans Asme2019; 141.
56.
GhodselahiTVesaghiMAAzizollahS, et al.XPS study of the Cu@Cu2O core-shell nanoparticles. Appl Surf Sci2008; 255: 2730–2734.
57.
DongdongLZhenyuZJiajianF, et al.Environment-friendly chemical mechanical polishing for copper with atomic surface confirmed by transmission electron microscopy. Colloids Surf A: Physicochem Eng Asp2023; 656: 130500.
58.
Gi DukKYoung WooKEricM, et al.Controlled electropolishing of copper foils at elevated temperature. Appl Surf Sci2014; 307: 731–735.
59.
JunichiIJoo WonLSang HwuiH, et al.Native oxidation of ultra high purity Cu bulk and thin films. Appl Surf Sci2006; 253: 2825–2829.
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