The fabrication and properties of short carbon fiber reinforced copper matrix composites

Abstract

Short carbon fibers (SCFs) reinforced copper matrix composites, fiber volume fraction of which ranged from 10% to 30%, were prepared by electroless copper plating plus cold press and sintering technique. SCFs were copperized directly by electroless plating using hypophosphite as reducing agent. The effects of SCFs volume fraction on mechanical, thermal, and electrical properties of the composites were discussed. The results indicated that the microhardness and thermal expansion property of Cu/SCFs composites increased with increasing fibers content, owing to the high strength of SCF. However, thermal conductivity and electrical conductivity reversed, it was attributed to the performance of carbon fiber itself; furthermore, more defects and interfaces in the matrix acted as barriers to heat and electronic transfer.