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Abstract

Many properties of brominated epoxy resin, a type of material widely used in printed circuit boards (PCBs), such as the coefficient of thermal expansion (CTE) (pre and post T_g), dielectric constant (D_k), dissipation factor (D_f), tensile strength, and Young’s modulus, have been evaluated according to size and content in terms of the weight of the aluminum nitride (AlN) filler. It has been found that the performance of epoxy resin improves significantly when AlN is used as the filler. Excellent properties were obtained when 2.3 μm AlN was added till 50 wt%; i.e., CTE (pre T_g) = 27 ppm/°C, T_g= 128 °C, D_f = 0.016, D_k = 7.5, and Young’s modulus = 7.5 GPa. The SEM results show that the dispersion of AlN nanopowder filler is largely homogeneous.

Keywords

AlN brominated epoxy resin coefficient of thermal expansion (CTE)dielectric constant (Dk)dissipation factor (Df)tensile strength Young’s modulus

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References

Sanchez-Lopez, J.C. , Alcala, M.D. , Real, C. and Fernandez, A. (1999). The Use of X-ray Photoelectron Spectroscopy to Characterize Fine AlN Powders Submitted to Mechanical Attrition , NanoStructured Materials, 11(2): 249-257 .

Kim, Wonho and Bae, Jong-Woo (1999). Thermally Conductive EMC (Epoxy Molding Compound) for Microelectronic Encapsulation , Polym. Eng. Sci., 39(4): 756-766 .

Oliveira, M. , Olhero, S. , Rocha, J. and Ferreira, J.M.F. (2003). Controlling Hydrolysis and Dispersion of AlN Powders in the Aquerous Media , J. Colloid Interface Sci., 261(2): 456-463 .

Boey, Freddy Y.C. , Song, X.L. , Yue, C.Y. and Zhao, Q. (1999). Effect of AlN filler on the Properties of a Modified Bismaleimide Resin , J. Mater. Process. Tech., 89-90: 437-439 .

Xu, Yungsheng and Chung, D.D.L. (2000). Increasing the Thermal Conductivity of Boron Nitride and Aluminum Nitride Particle Epoxy-matrix Composites by Particle Surface Treatments , Compos. Interface, 7(4): 243-256 .

Bae, Jong-Woo , Kim, Wonho and Cho, Suk-Hyeon (2000). The Properties of AlN-filled Epoxy Molding Compounds by the Effects of Filler Size Distribution , J. Mater. Sci., 35(23): 5907-5913 .

Xu, Yunsheng , Chung, D.D.L. and Mroz, Cathleen (2001). Thermally Conducting Aluminum Nitride Polymer-matrix Composites , Compos. Pt. A-Appl. Sci. Manuf., 32(12): 1749-1757 .

Hong, S.G. and Wang, T.C. (1994). The Effect of Copper Oxides on the Curing of Brominated Epoxy Resins , Thermochim. Acta, 237(2): 305-316 .

Coombs, Clyde F., Jr. (1996). Printed Circuits Handbook, 4th edn, pp. 8.4 and 10.18, McGraw-Hill Companies, Inc., New York .

10.

Tyan, Horng-Long , Liu, Yau-Cheng and Wei, Kung-Hwa (1999). Thermally and Mechanically Enhanced Clay/Polyimide Nanocomposite via Reactive Organoclay , Chem. Mater., 11(7): 1942-1947 .

11.

Messersmith, P.B. and Giannelis, E.P. (1995). Synthesis and Barrier Properties of Poly (Epsilon-Caprolactone)-Layered Silicate Nanocomposites , J. Polym. Sci. Pol. Chem., 33(7): 1047-1057 .

12.

Gonsalves, Kenneth E. , Chen, Xiaohe and Baraton, Marie-Isabelle (1997). Mechanistic Investigation of the Preparation of Polymer/Ceramic Nanocomposites , NanoStructured Mater., 9(1-8): 181-184 .

13.

Keen Corporation , Howe Division, Bulletin, 1988.

14.

Wong, C.P. and Raja, S. (1999). Bollampally, Thermal Conductivity, Elastic Modulus and Coefficient of Thermal Expansion of Polymer Composites Filled with Ceramic Particles for Electronic Packaging , J. Appl. Polym. Sci., 74(14): 3396-3403 .

15.

Vo, H.T. , Todd, M. , Shi, F.G. , Shapiro, A.A. and Edwards, M. (2001). Towards Model-based Engineering of Underfill Materials: CTE Modeling , Microelectron. J., 32(4): 331-338 .

16.

Mussler, B.H. , Venigalla, S. and Johnson, W.C. (2000). Advanced Materials & Powders , Am. Ceram. Soc. Bull., 79(6): 45-56 .

17.

Vo, Hung T. and Shi, Frank G. (2002). Towards Model-based Engineering of Optoelectronic Packaging Materials Dielectric Constant Modeling , Microelectron. J., 33(5-6): 409-415 .

18.

Todd, Michael G. and Shi, Frank G. (2003). Molecular Basis of the Interphase Dielectric Properties of Microelectronic and Optoelectronic Packing Materials , IEEE Trans. Compon. Packaging Technol., 26(3): 667-672 .

19.

Jesionowski, T. , Bula, K. , Janiszewski, J. and Jurga, J. (2003). The Influence of Filler Modification on its Aggregation and Dispersion Behaviour in Silica/PBT Composite , Compos. Interfaces, 10(2-3): 225-242 .

20.

Scurati, A. , Manas-Zloczower, I. and Feke, D.L. (2002). Influence of Powder Surface Treatment on the Dispersion Behavior of Silica into Polymeric Materials , Rubber Chem. Technol., 75(4): 725-737 .

Size Effect of AlN on the Performance of Printed Circuit Board (PCB) Material-brominated Epoxy Resin

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