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Research article

First published 2006-09

Thermomechanical Behavior of a Polyurethane Shape Memory Polymer Foam

W. M. Huang, C. W. Lee, H. P. Teo

Journal of Intelligent Material Systems and Structures

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Research article

First published 2013-6

Relationship between microstructure and properties of false-twist textured and stabilized polylactide. Part 1: dimensional stability,mechanical properties and thermomechanical behavior

Diana Cayuela, Lucila Montero, Marta Riba [...]

Textile Research Journal

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Research article

First published 2009-09

A Phenomenological Description of the Thermomechanical Coupling and the Rate-dependent Behavior of Shape Memory Alloys

Paulo Cesar C. Monteiro, Marcelo A. Savi, Theodoro Antoun Netto [...]

Journal of Intelligent Material Systems and Structures

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Research article

First published 2012-06

A Study of the Thermomechanical Behavior of Skin Tissue in Moxibustion Using a Mathematical Method

Miao Liu, Sang Ken Kauh

Medical Acupuncture

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Other

First published 1993-10

Thermomechanical Behavior of an Fe-Cr-Ni-Mn-Si Polycrystalline Shape Memory Alloy

K. Tanaka, T. Hayashi, Y. Aida [...]

Journal of Intelligent Material Systems and Structures

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Research article

First published 2001-11

Modeling and Numerical Simulation on Thermomechanical Behavior of SMA Plates with Two-Way Shape Memory Effect

Toshiyuki Takagi, Yun Luo, Shunji Suzuki [...]

Journal of Intelligent Material Systems and Structures

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Research article

First published 2018-5

A non-local implicit gradient-enhanced model for thermomechanical behavior of shape memory alloys

Hojjat Badnava, Mohammad Mashayekhi, Mahmoud Kadkhodaei [...]

Journal of Intelligent Material Systems and Structures

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Research article

First published 2001-7

Influence of Microstructure Coarsening on Thermomechanical Fatigue Behavior of Pb/Sn Eutectic Solder Joints

Hong Tang, Cemal Basaran

International Journal of Damage Mechanics

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Research article

First published 2005-12

Three-dimensional Finite Element Analysis of Thermomechanical Behavior in Flip-chip Packages under Temperature Cycling Conditions

G. H. Wu, T. C. Tsein, S. H. Ju

Journal of Reinforced Plastics and Composites

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Research article

First published 1976-7

Thermomechanical Behavior of Nonwovens

Charles J. Shimalla, John C. Whitwell

Textile Research Journal

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