The influence of microstructure coarsening on thermomechanical fatigue behavior of eutectic solder joint is investigated by numerical simulation. A phase growth model is selected based on the experimental observation and incorporated in a damage mechanics based viscoplastic constitutive model. Comparisons between the simulations with and without coarsening effect are made for isothermal, cyclic shear testing and thermal cycling of solder joints in BGA electronic packaging.
Get full access to this article
View all access options for this article.
References
1.
Adams, P. J., 1986, “Thermal Fatigue of Solder Joints in Micro-Electronic Devices,” M.S. Thesis, Department of Mechanical Engineering, MIT, Cambridge, MA.
2.
Armstrong, P. J. and Frederick, C. O., 1966, “A Mathematical Representation of the Multiaxial Bauschinger Effect,” G.E.G.B. Report RD/B/N731.
3.
Basaran, C. , Desai, C. S. and Kundu, T., 1998a, “Thermomechanical Finite Element Analysis of Problems in Electonic Packaging using the Disturbed State Concept. Part I: Theory and Formulation,”J. Electronic Packag., Vol. 120, No. 1, pp. 41–47.
4.
Basaran, C. , Desai, C. S. and Kundu, T., 1998b, “Thermomechanical Finite Element Analysis of Problems in Electonic Packaging using the Disturbed State Concept. Part II: Verification and Application,”J. Electronic Packag., Vol. 120, No. 1, pp. 48–54.
5.
Basaran, C. and Chandaroy, R., 1998. “Mechanics of Pb40/Sn60 Near-Eutectic Solder Alloys Subjected to Vibration,”Applied Mathematical Modeling, Vol. 22, pp. 601–627.
6.
Basaran, C. and Yan, C., 1998, “A Thermodynamic Framework for Damage Mechanics of Solder Joints,”Journal of Electronic Packaging, Trans. ASME, Vol. 120, pp. 379–384.
7.
Basaran, C. , Tang, H., Dishongh, T. and Searls, D., 2001a, “Computer Simulations of Solder Joint Reliability Tests,”Advanced Packaging, pp. 1-1, 17–26 May 2001.
8.
Basaran, C. , Zhao, Y. and Cartwright, A. A., 2001b, “Damage Mechanics of Microelectronics Solder Joints Under Concurrent Vibration and Thermal Loading,”Int. J. of Damage Mechanics, April 2001.
9.
Basaran, C. and Tang, H., “Implementation of a Thermodynamic Framework for Damage Mechanics of Solder Interconnects in Microelectronic Packaging,”Int. J. of Damage Mechanics (12/2000-Accepted).
10.
Bazant, Z. P. , 1991, “Why Continuum Damage is Nonlocal: Micromechanics Arguments,”Journal Engineering Mechanics, ASCE, Vol. 117, No. 5, pp. 1070–1087.
11.
Busso, E. P. , Kitano, M. and Kamazawa, 1992, “A Visco-Plastic Constitutive Model for 60/40 Tin-Lead Solder Used in IC Package Joints,”Journal of Engineering Materials and Technology, Vol. 114, pp. 331–337.
12.
Chaboche, J. L. , 1989, “Constitutive Equations for Cyclic Plasticity and Viscoplasticity,”International Journal of Plasticity, Vol. 5, pp. 247–302.
13.
Chaboche, J. L. and Lesne, P. M., 1988, “A Non-Linear Continuous Fatigue Damage Model,”Fatigue Fracture Engineering Mater. and Struct., Vol. 11, pp. 1–17.
14.
Chow, C. L. and Yang, F., 1998, “Damage Mechanics Characterization on Fatigue Behavior of a Solder Joint Material,”ASME International Mechanical Engineering Congress & Exposition, Anaheim, California, pp. 1–14.
15.
Chow, C. L. and Chen, X. F., 1992, “An Anisotropic Model of Damage Mechanics based on Endochronic Theory of Plasticity,”Int. Journal of Fracture, Vol. 55, pp. 115–130.
16.
Dasgupta, A. , Oyan, C., Barker, D. and Pecht, M., 1992, “Solder Creep-Fatigue Analysis by an Energy-Partitioning Approach,”Trans. ASME, J. Electronic Packaging, Vol. 114, pp. 152–160.
17.
Frear, D. , Morgan, H., Burchett, S. and Lau, J., 1994, The Mechanics of Solder Alloy Interconnects. Chapman & Hall, New York.
18.
Frear, D. , Burchett, S. N. and Neilsen, M. K., 1997, “Life Prediction Modeling of Solder Interconnects for Electronic System,”Advances in Electronic Packaging, EEP-Vol. 19-2, pp. 1515–1522.
19.
Friedel, J. , 1964, Dislocations, Pergamon Press.
20.
Halford, G. R. , 1983, SAMPE Quarterly, Vol. 14, No. 3, pp. 17–25.
21.
Ju, J. W. , 1989, “On Energy-Based Coupled Elastoplastic Damage Theories: Constitutive Modeling and Computational Aspects,”International J. Solids Structures, Vol. 25, No., 7, pp. 803–833.
22.
Kachanov, L. M. , 1986, Introduction of Continuum Damage Mechanics. Nijhoff (Martinus), Dordrecht.
23.
Kashyap, P. and Murty, G.S., 1981, “Experimental Constitutive Relations for the High Temperature Deformation of a Pb-Sn Eutectic Alloy,”J. Mater. Sci. Eng., Vol. 50, pp. 205–213.
24.
Kashyap, P. and Murty, G.S., 1983, “Evaluation of Microstructural Instability during the Differential Strain Rate Test of a Superplastic Alloy,”J. Mater. Sci., Vol. 18, pp. 2063–2070.
25.
Krajcinovic, D. , 1989, “Damage Mechanics,”Mechanics of Materials, Vol. 8, pp. 117–197.
26.
Lemaitre, J. , 1990, A Course on Damage Mechanics, Springer.
27.
MarSn, J. W. and Doherty, R. D., 1976, “Stability of Microstructure in Metallic Systems,”Cambridge Univ Press, Cambridge.
28.
Murakami, S. , 1988, “Mechanical Modeling of Material Damage,”ASME Journal of Applied Mechanics, vol. 55, pp. 280–286.
29.
McDowell, D. L. , Miller, M. P. and Brooks, D. C., 1994, “A Unified Creep-Plasticity Theory for Solder Alloys,”Fatigue Testing of Electronic Materials, ASTM STP 1153, pp. 42–59.
30.
Morris, J. W. , Tribula, D., Suumers, T. S. E. and Grivas, D., 1991, “The Role of Microstructure in Thermal Fatigue of Pb-Sn Solder Joints,”Solder Joint Reliability, Van Nostrand Reinhold, pp. 225–265.
31.
Morris, J. W. and Reynolds, H. L., 1992, “The Influence of Microstructure on the Mechanics of Eutectic Solders,”Advances in Electronic Packaging, pp. 1529–1534.
32.
Qian, Z. , Ren, W. and Liu, S., 1999, “A Damage Coupling Framework of Unified Viscoplasticity for the Fatigue of Solder Alloys,”J. Electronic Packaging, Vol. 21, pp. 162–168.
33.
Rabotnov, Y. N. , 1969, “Fundamental Problems in Visco-Plasticity,” in Recent Advanced in Applied Mechanics, Academic Press, New York, NY.
34.
Sayama, T. , Takayanagi, T. and Mori, T., 1999, “Analysis of Phase Growth Process in Sn/Pb Eutectic Solder Joint,”Advances in Electronic Packaging, EEP-Vol. 26-1, pp. 581–587.
35.
Sherby, O. D. , 1962, Acta Metallurgica, Vol. 10, pp. 135–147.
36.
Smithells, C. J. , Metals Reference Book, Brandes, 6th edn., 1983.
37.
Solomon, H. D. , 1986a, “Fatigue of 60/40 Solder,”IEEE Trans. Components Hybrids Manufacturing Technol, CHMT-9(4), pp. 423–432.
38.
Solomon, H. D. , 1986b, “Creep, Strain-Rate-Sensitvity and Low Cycle Fatigue of 60/40 Solder,”Brazing and Soldering, Vol. 11, pp. 68–75.
39.
Solomon, H. D. , 1989, “Strain-Life Behavior in 60/40 Solder,”ASME Journal of Electronic Packaging, Vol. 111, pp. 75–82.
40.
Solomon, H. D. and Tolksdorf, E. D., 1996, “Energy Approach to the Fatigue of 60/40 Solder: Part II—Influence of Hold Time and Asymmetric Loading,”ASME Journal of Electronic Packaging, Vol. 188, pp. 67–71.
41.
Vaynman, S. and Fine, M. E., 1991, “Solder Joint Reliability: Theory and Application,”Van Nostrand Reinhold.
42.
Valanis, K. C. , 1997, “Some Thoughts on Thermodynamics of Internal Variables,”Arch. Mech., Vol. 49, No. 2, pp. 443–445.
43.
Voyiadjis, G. Z. and Thygarajan, G., 1996, “A Damage Cyclic Model for Metal Matrix Composites,” in Damage and Interface Debonding in Composites, Voyiadis and Allen, eds., Elsevier, New York, NY.
44.
Zhao, Y. , Basaran, C., Cartwright, A. and Dishongh, T., 1999, “Thermomechanical Behavior of Micron Scale Solder Joints: An Experimental Observation,”Journal of the Mechanical Behavior of Materials, Vol. 10, pp. 135–146.
45.
Zhao, Y. , Basaran, C., Cartwright, A. and Dishongh, T., 2000, “Thermomechanical Behavior of Micron Scale Solder Joints under Dynamic Loads,”Mechanics of Materials, Vol. 32, No. 3, pp. 161–173.
