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1-2 of 2 results for solder paste printing thickness

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Select article: Integrating the Taguchi method and the multiattribute decision-making method to optimize the surface mount technology solder paste printing thickness process

Free access

Research article

First published 2013-8

Integrating the Taguchi method and the multiattribute decision-making method to optimize the surface mount technology solder paste printing thickness process

Shen-Tsu Wang

Proceedings of the Institution of Mechanical Engineers,Part B: Journal of Engineering Manufacture

Select article: Experimental studies on application of silver paste in thermosonic flip-chip bonding

Open access

Research article

First published 2023-3

Experimental studies on application of silver paste in thermosonic flip-chip bonding

Hui Yang, Zhengbang Zhan

Journal of Low Frequency Noise,Vibration and Active Control

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