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Research article

First published 2012-4

Proportional hazards model for reliability analysis of solder joints under various drop-impact and vibration conditions

M-Y You, F Liu, G Meng

Proceedings of the Institution of Mechanical Engineers,Part O: Journal of Risk and Reliability

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Research article

First published 2007-4

Effect of high temperature storage test on reliability of eutectic Sn–Cu/ENIG solder joint

J.-W. Yoon, S.-W. Kim, S.-B. Jung

Materials Science and Technology

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Research article

First published 2009-12

Interfacial reaction and mechanical reliability of eutectic Sn–0·7Cu/immersion Ag-plated Cu solder joint

J.-W. Yoon, S.-B. Jung

Materials Science and Technology

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Research article

First published 2014-8

Effects of component placement on solder joint through-life reliability

Ryan SH Yang, Derek R Braden, Guang-Ming Zhang [...]

Proceedings of the Institution of Mechanical Engineers,Part O: Journal of Risk and Reliability

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Research article

First published 1999-8

Reliability assessment of a digital electronic board assembly using the physics-of-failure approach: A case study

C N Oguibe, D J Williams

Proceedings of the Institution of Mechanical Engineers,Part B: Journal of Engineering Manufacture

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Research article

First published 2018-5

Microstructure and reliability of Mo nanoparticle reinforced Sn–58Bi-based lead-free solder joints

Li Yang, Lu Zhu, Yaocheng Zhang [...]

Materials Science and Technology

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Research article

First published 2013-12

Solder joint reliability of Sn–0·7Cu and Sn–0·3Ag–0·7Cu lead-free solder alloys solidified on copper substrates with different surface roughnesses

Satyanarayan, K N Prabhu

Materials Science and Technology

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Research article

First published 2026

Investigation on microstructure evolution and mechanical reliability of Sn-Ni high-temperature resistant solder joints fabricated through microwave hybrid heating

Shuye Zhang, Shuai Zhang, Changhao Lin [...]

Proceedings of the Institution of Mechanical Engineers,Part L: Journal of Materials: Design and Applications

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Research article

First published 1984-1

Soldering technology — decade of developments

C. J. Thwaites

International Materials Reviews

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Research article

First published 2025-2

Fatigue life prediction of BGA solder joint of several alloy compositions under an isothermal harmonic vibration

Jihen Rebai, Abdelkhalak El Hami, Sinda Ghenam [...]

Proceedings of the Institution of Mechanical Engineers,Part C: Journal of Mechanical Engineering Science

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