To ensure durable performance and optimal function of electronic components, it is crucial to guarantee their reliability, robustness and goodness of fit. The solder joints used in the BGA (Ball Grid Array) component play an intrinsic role in the reliability of the system. The vibration present in BGA triggers fatigue in solder joints, which raises a major reliability problem in various sectors such as aerospace, automotive and military industries. This study handles the response to a harmonic vibration at three specific temperatures (−40°C, 25°C, and 125°C) for four types of solder alloys in BGA Soldering. Within this framework, predicting the fatigue life of BGA solder joints with various alloy compositions under the influence of an isothermal harmonic vibration emerges as a crucial challenge in the design as well as reliability of modern electronic devices. The investigated solder compositions are SAC105, SAC305, SAC405, and InnoLot. To simulate and analyze the behavior of solder joints, we used the Ansys APDL finite element analysis (FEA). At both 125°C and −40°C, the Von Mises values proved to exceed those observed at 25°C. Likewise, an S-N curve for InnoLot and the different SACs, under a harmonic vibration at 25°C, was fitted using the Basquin power law relationship. As far as the current research work is concerned, an initial comparison was enacted between InnoLot and SAC alloys under an isothermal harmonic vibration, aiming to ascertain the most reliable alloy. The fatigue life under a harmonic vibration loading at 25°C was estimated. The results revealed that under a harmonic vibration at 25°C, the InnoLot solder displayed the longest lifespan, while the SAC105 solder exhibited the shortest fatigue life.
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