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Research article

First published 2011-8

The effect of uncut chip thickness on edge chipping and wheel performance in groove grinding of single crystal silicon

J-J J Wang, Y-Y Liao, C-Y Huang

Proceedings of the Institution of Mechanical Engineers,Part B: Journal of Engineering Manufacture

Free access

Research article

First published 2007-10

High-pressure phase transformation as the mechanism of ductile chip formation in nanoscale cutting of silicon wafer

M B Cai, X P Li, M Rahman

Proceedings of the Institution of Mechanical Engineers,Part B: Journal of Engineering Manufacture

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Research article

First published 1997-5

Silicon Drift Detectors with On-Chip Electronics for X-Ray Spectroscopy

C. Fiorini, A. Longoni, R. Hartmann [...]

Journal of X-Ray Science and Technology

Open access

Review article

First published 2020-9

An introduction and review on innovative silicon implementations of implantable/scalp EEG chips for data acquisition,seizure/behavior detection,and brain stimulation

Weiwei Shi, Jinyong Zhang, Zhiguo Zhang [...]

Brain Science Advances

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Research article

First published 1990-11

Preliminary experiments in nerve regeneration through laser-drilled holes in silicon chips

Joseph M. Rosen, Morton Grosser, Vincent R. Hentz

Restorative Neurology and Neuroscience

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Research article

First published 2013-12

From white gold to silicon chips: Hydraulic technology,electric power and Silicon Valley

James C Williams

Social Science Information

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Research article

First published 1997-2

Regeneration of central nervous axons through micromachined silicone chips

G. Lundborg, M. Kanje, N. Danielsen [...]

Journal of Hand Surgery (European Volume)

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Research article

First published 2011-1

The Nintendo Entertainment System and the 10NES Chip: Carving the Video Game Industry in Silicon

Casey O'Donnell

Games and Culture

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Research article

First published 2019-5

SiO 2 -coated Cu nanoparticle/epoxy resin composite and its application in the chip packaging field

Qing Tian, Junhui Li, Xiao Huiwei [...]

High Performance Polymers

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Research article

First published 2004-1

Thermal stress induced by the adhesion topology of a semiconductor integrated circuit package

D C Lee, M G Kim, J I Lee

Proceedings of the Institution of Mechanical Engineers,Part L: Journal of Materials: Design and Applications

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