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Research article

First published 2006-1

Integrating Semiconductor Device Characterisation and Reliability into Electrical Engineering Education

Jiann S. Yuan, Hong Yang

International Journal of Electrical Engineering & Education

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Book review

First published 1983-1

Book Review: Semiconductor Devices & Circuits: Reliability and Degradation

D. C. Northrop

International Journal of Electrical Engineering & Education

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Research article

First published 2002-7

Modelling of trap assisted tunnelling through thin dielectric layers

G. Iannaccone

Materials Science and Technology

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Research article

First published 1998-12

Application of Thermosetting Copolyimides as Coatings for Protection of Semiconductor Devices

Nobuyuki Furukawa, Hisashi Katayama, Ken-Ich Kitamura

High Performance Polymers

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Research article

First published 1998-03

Siloxane Modified Polyimides for Microelectronics Coating Applications

Yasuharu Yamada

High Performance Polymers

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Research article

First published 2020-2

Reliability assessment in dynamic field environment incorporating multiple environmental effects

Yikun Cai, Yu Zhao, Xiaobing Ma [...]

Proceedings of the Institution of Mechanical Engineers,Part O: Journal of Risk and Reliability

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Research article

First published 2025-9

Development of safety certification standards for semiconductor equipment for prevention of occupational accidents in Korea: A methodology based on semiconductor equipment and materials international (SEMI) standards

Seung Nam Min, Sanghyun Kim, Dong Joon Kim [...]

WORK: A Journal of Prevention,Assessment & Rehabilitation

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Research article

First published 2021-12

Structural characterization of semiconductor multi-layer pad

Michele Calabretta, Alessandro Sitta, Salvatore Massimo Oliveri [...]

Proceedings of the Institution of Mechanical Engineers,Part C: Journal of Mechanical Engineering Science

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Research article

First published 2012-10

Effect of microstructure on hardness of submicrometre thin films and nanostructured devices

S. J. Bull, L. Sanderson, N. Moharrami [...]

Materials Science and Technology

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Research article

First published 2004-2

Residual Stress Mapping of Epoxy Molding Compound in a Ball Grid Array Microelectronic Package Using a Fluorescent Sensor

Naoki Muraki, Nobuhiro Matoba, Takayuki Hirano [...]

Applied Spectroscopy

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