Application of Thermosetting Copolyimides as Coatings for Protection of Semiconductor Devices

Abstract

Six kinds of end-capped thermosetting copolyimides were prepared and applied as a junction coating resin for protection of semiconductor devices. The copolyimides are composed of aromatic dianhydrides, aromatic diamines, bis(γ-aminopropyl)tetramethyldisiloxane and reactive end-capping agents. Maleic anhydride and γ-aminopropyltrimethoxysilane were used as the reactive end-groups due to increasing their crosslinking reactivity. The copolyimides were cured at 200 °C, then the thermal and mechanical properties of the hardened copolyimides were characterized. The thermosetting copolyimides exhibited good adherence to a silicon wafer and an encapsulant without an adhesion promoter due to their incorporated disiloxane composition. The residual interface stress between the copolyimides and a silicon wafer was 3.5–3.6 MPa. The copolyimides were applied as a junction coating for protection of a semiconductor device and exhibited good reliability.

Get full access to this article

View all access options for this article.

References

[1] Wilson D , Stenzenberger H D and Hergenrother P M (ed) 1990 Polyimides (New York: Blackie)

[2] Lupinski J H and Moor R S (ed) 1988 Polymeric Materials for Electronics Packaging and Interconnection (Washington, DC: American Chemical Society)

[3] Geldermans P , Goldsmith C and Bedetti F 1984 Polyimides 1st edn, vol 2, ed K L Mittal (New York: Plenum) p 695-695

[4] Ghosh M K and Mittal K L (ed) 1996 Polyimides (New York: Dekker)

[5] Yun H K , Cho K , An J H , Park C E , Sim S M and Park J M 1994 J. Adhes. Sci. Technol. 8 1395-1395

[6] Numata S , Misawa T , Makino D , Imaizumi J and Kinjyo N 1988 Mater. Res. Soc. Symp. Proc. 108 113-113

[7] Biernath R W and Soane D S 1990 Nitto-Giho 28 (2) 13-13

[8] Monk D J , He Y and Soane D S 1992 Mater. Res. Soc. Symp. Proc. 264 175-175

[9] Bruck S M and Knorr D B 1992 Mater. Res. Symp. Soc. Proc. 264 251-251

10.

[10] Geldermans P , Goldsmith C and Bedetti F 1984 Polyimides vol 2 (New York: Plenum) p 715-715

11.

[11] Wilson A M 1984 Polyimides vol 2 (New York: Plenum) p 695-695

12.

[12] Bolger J C 1984 Polyimides vol 2 (New York: Plenum) p 871-871

13.

[13] Furukawa N and Yamada Y 1995 J. Adhes. Japan 31 438-438

14.

[14] Stenzenberger H D 1994 Adv. Polym. Sci. 117 164-164

15.

[15] Hou T H and Bryant R G 1997 High Perform. Polym. 9 437-437

16.

[16] Laurienzo P , Malcinconico M , Perenze N and Segre A L 1994 Macromol. Chem. Phys. 195 3057-3057

17.

[17] Spinv M , Brennau A , Rancourt J , Wilkes G L and McGrath J B 1990 Mater. Res. Soc. Symp. Proc. 175 179-179

18.

[18] Furukawa N, Yuasa M, Fujiyama T, Saito K, Shinohara M and Kimura Y 1998 Nippon Kagaku Kaishi 298