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Articles (19)

Journals (0)

1-10 of 19 results for eutectic Sn-Pb solder

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Select article: The Connection between Microstructural Damage Modeling and Continuum Damage Modeling for Eutectic Sn-Pb Solder Alloys

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Research article

First published 2005-10

The Connection between Microstructural Damage Modeling and Continuum Damage Modeling for Eutectic Sn-Pb Solder Alloys

P. Sharma, A. Dasgupta, G. Cuddalorepatta

International Journal of Damage Mechanics

Select article: Influence of Microstructure Coarsening on Thermomechanical Fatigue Behavior of Pb/Sn Eutectic Solder Joints

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Research article

First published 2001-7

Influence of Microstructure Coarsening on Thermomechanical Fatigue Behavior of Pb/Sn Eutectic Solder Joints

Hong Tang, Cemal Basaran

International Journal of Damage Mechanics

Select article: Microstructures formed from mixed solders on copper substrate

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Research article

First published 2009-12

Microstructures formed from mixed solders on copper substrate

L. Snugovsky, P. Snugovsky, D. D. Perovic [...]

Materials Science and Technology

Select article: Investigation of interfacial reaction between eutectic Sn–Pb solder droplet and Au/Ni/Cu pad

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First published 2008-6

Investigation of interfacial reaction between eutectic Sn–Pb solder droplet and Au/Ni/Cu pad

F. Q. Li, C. Q. Wang, Y. H. Tian

Materials Science and Technology

Select article: Metallurgy of low temperature Pb-free solders for electronic assembly

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Research article

First published 1995-1

Metallurgy of low temperature Pb-free solders for electronic assembly

J. Glazer

International Materials Reviews

Select article: Effect of compositional changes and impurities on wetting properties of eutectic Sn–Bi alloy used as solder

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Research article

First published 1985-3

Effect of compositional changes and impurities on wetting properties of eutectic Sn–Bi alloy used as solder

C. A. MacKay, W. D. von Voss

Materials Science and Technology

Select article: Decrease in fatigue life of Sn - 3.8 wt-%Ag - 1.2 wt-%Cu alloy solder joints due to thermal cycling

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Research article

First published 2003-10

Decrease in fatigue life of Sn - 3.8 wt-%Ag - 1.2 wt-%Cu alloy solder joints due to thermal cycling

H. Kato, K. Matsubara, K. Kageyama

Materials Science and Technology

Select article: Thermomechanical behaviour of environmentally benign Pb-free solders

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Research article

First published 2009-11

Thermomechanical behaviour of environmentally benign Pb-free solders

N Chawla

International Materials Reviews

Select article: Effect of cooling rate on microstructure of Ag–Cu–Sn solder alloys

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Research article

First published 2005-1

Effect of cooling rate on microstructure of Ag–Cu–Sn solder alloys

L. Snugovsky, P. Snugovsky, D. D. Perovic [...]

Materials Science and Technology

Select article: Interrelation of wettability–microstructure–tensile strength of lead-free Sn–Ag and Sn–Bi solder alloys

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Research article

First published 2016-8

Interrelation of wettability–microstructure–tensile strength of lead-free Sn–Ag and Sn–Bi solder alloys

Wislei R. Osório, Amauri Garcia

Science and Technology of Welding and Joining

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