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1-5 of 5 results for electromigration failure time

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Select article: Damage mechanics of electromigration and thermomigration in lead-free solder alloys under alternating current: An experimental study

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Research article

First published 2014-3

Damage mechanics of electromigration and thermomigration in lead-free solder alloys under alternating current: An experimental study

Wei Yao, Cemal Basaran

International Journal of Damage Mechanics

Select article: Electromigration in lead-free solder joints under high-frequency pulse current: An experimental study

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First published 2013-11

Electromigration in lead-free solder joints under high-frequency pulse current: An experimental study

Wei Yao, Cemal Basaran

International Journal of Damage Mechanics

Select article: SiO 2 -coated Cu nanoparticle/epoxy resin composite and its application in the chip packaging field

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Research article

First published 2019-5

SiO 2 -coated Cu nanoparticle/epoxy resin composite and its application in the chip packaging field

Qing Tian, Junhui Li, Xiao Huiwei [...]

High Performance Polymers

Select article: Experimental Damage Mechanics of Micro/Power Electronics Solder Joints under Electric Current Stresses

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Research article

First published 2006-01

Experimental Damage Mechanics of Micro/Power Electronics Solder Joints under Electric Current Stresses

Hua Ye, Cemal Basaran, Douglas C. Hopkins

International Journal of Damage Mechanics

Select article: Evaluating the impact of FSDOI physical design strategies on automotive-grade semiconductor chip reliability and performance

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First published 2025-11

Evaluating the impact of FSDOI physical design strategies on automotive-grade semiconductor chip reliability and performance

Jianhua Zhang, Yun Wang, Chao Lu [...]

Journal of Computational Methods in Sciences and Engineering

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