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1-4 of 4 results for electromigration failure time

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Restricted accessResearch articleFirst published March, 2014

Damage mechanics of electromigration and thermomigration in lead-free solder alloys under alternating current: An experimental study

Wei Yao, Cemal Basaran

International Journal of Damage Mechanics

Restricted accessResearch articleFirst published November, 2013

Electromigration in lead-free solder joints under high-frequency pulse current: An experimental study

Wei Yao, Cemal Basaran

International Journal of Damage Mechanics

Restricted accessResearch articleFirst published May, 2019

SiO 2 -coated Cu nanoparticle/epoxy resin composite and its application in the chip packaging field

Qing Tian, Junhui Li, Xiao Huiwei [...]

High Performance Polymers

Restricted accessResearch articleFirst published January, 2006

Experimental Damage Mechanics of Micro/Power Electronics Solder Joints under Electric Current Stresses

Hua Ye, Cemal Basaran, Douglas C. Hopkins

International Journal of Damage Mechanics

Search results

Articles (4)

Journals (0)

1-4 of 4 results for electromigration failure time

Sort by:

Relevance

Select all

Sort by:

Relevance

Restricted accessResearch articleFirst published March, 2014

Damage mechanics of electromigration and thermomigration in lead-free solder alloys under alternating current: An experimental study

Wei Yao, Cemal Basaran

International Journal of Damage Mechanics

Restricted accessResearch articleFirst published November, 2013

Electromigration in lead-free solder joints under high-frequency pulse current: An experimental study

Wei Yao, Cemal Basaran

International Journal of Damage Mechanics

Restricted accessResearch articleFirst published May, 2019

SiO 2 -coated Cu nanoparticle/epoxy resin composite and its application in the chip packaging field

Qing Tian, Junhui Li, Xiao Huiwei [...]

High Performance Polymers

Restricted accessResearch articleFirst published January, 2006

Experimental Damage Mechanics of Micro/Power Electronics Solder Joints under Electric Current Stresses

Hua Ye, Cemal Basaran, Douglas C. Hopkins

International Journal of Damage Mechanics