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Articles (25)

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1-10 of 25 results for Sn–Ag solder alloy

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Select article: Formation of microstructure in Ag–In–Sn solder alloys

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Research article

First published 2007-4

Formation of microstructure in Ag–In–Sn solder alloys

L. Snugovsky, P. Snugovsky, D. D. Perovic [...]

Materials Science and Technology

Select article: Effect of aging treatment on microstructure and creep behaviour of Sn–Ag and Sn–Ag–Bi solder alloys

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Research article

First published 2014-4

Effect of aging treatment on microstructure and creep behaviour of Sn–Ag and Sn–Ag–Bi solder alloys

A. F. Abd El-Rehim, H. Y. Zahran

Materials Science and Technology

Select article: Interrelation of wettability–microstructure–tensile strength of lead-free Sn–Ag and Sn–Bi solder alloys

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Research article

First published 2016-8

Interrelation of wettability–microstructure–tensile strength of lead-free Sn–Ag and Sn–Bi solder alloys

Wislei R. Osório, Amauri Garcia

Science and Technology of Welding and Joining

Select article: Experiments on the aging of Sn–Ag–Cu solder alloys

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Research article

First published 2005-6

Experiments on the aging of Sn–Ag–Cu solder alloys

L. Snugovsky, D. D. Perovic, J. W. Rutter

Powder Metallurgy

Select article: Experiments on the aging of Sn–Ag–Cu solder alloys

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Research article

First published 2004-8

Experiments on the aging of Sn–Ag–Cu solder alloys

L. Snugovsky, D.D. Perovic, J.W. Rutter

Materials Science and Technology

Select article: Effect of cooling rate on microstructure of Ag–Cu–Sn solder alloys

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Research article

First published 2005-1

Effect of cooling rate on microstructure of Ag–Cu–Sn solder alloys

L. Snugovsky, P. Snugovsky, D. D. Perovic [...]

Materials Science and Technology

Select article: Effects of triethanolamine and polyethylene glycol additives on electrodeposition of Sn–Ag solder alloy

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Research article

First published 2011-5

Effects of triethanolamine and polyethylene glycol additives on electrodeposition of Sn–Ag solder alloy

J-K Cho, J-H Kim, J-H Lim [...]

Materials Science and Technology

Select article: Interfacial reactions of Sn–Zn–Ag–Cu alloy on soldered Al/Cu and Al/Al joints

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Research article

First published 2018-10

Interfacial reactions of Sn–Zn–Ag–Cu alloy on soldered Al/Cu and Al/Al joints

Tomasz Gancarz, Janusz Pstrus, Katarzyna Berent

Science and Technology of Welding and Joining

Select article: Effect of Mn on Sn–Ag–Cu ternary lead free solder alloy–Cu assembly: A comparative study

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Research article

First published 2010-5

Effect of Mn on Sn–Ag–Cu ternary lead free solder alloy–Cu assembly: A comparative study

M. Ghosh, M. K. Gunjan, S. K. Das [...]

Materials Science and Technology

Select article: Decrease in fatigue life of Sn - 3.8 wt-%Ag - 1.2 wt-%Cu alloy solder joints due to thermal cycling

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Research article

First published 2003-10

Decrease in fatigue life of Sn - 3.8 wt-%Ag - 1.2 wt-%Cu alloy solder joints due to thermal cycling

H. Kato, K. Matsubara, K. Kageyama

Materials Science and Technology

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