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Research article

First published 2012-1

A study on the diamond grinding of ultra-thin silicon wafers

L Zhou, Y B Tian, H Huang [...]

Proceedings of the Institution of Mechanical Engineers,Part B: Journal of Engineering Manufacture

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Research article

First published 2007-10

Adsorption of Hyperbranched Polysiloxysilane Modified with Triethoxy Group onto the Silicon Wafer

Yasuko Yamada, Tomoyasu Hirai, Ryohei Kikuchi [...]

High Performance Polymers

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Research article

First published 2013-4

Design and evaluation of soft abrasive grinding wheels for silicon wafers

Shang Gao, Zhigang Dong, Renke Kang [...]

Proceedings of the Institution of Mechanical Engineers,Part B: Journal of Engineering Manufacture

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Research article

First published 2022-7

Investigation and multi-objective optimization of monocrystalline silicon wafering using wire electro-discharge machining

Anmol S Verma, Shankar Singh

Proceedings of the Institution of Mechanical Engineers,Part C: Journal of Mechanical Engineering Science

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Research article

First published 2011-10

Effect of slurry parameters on material removal rate in multi-wire sawing of silicon wafers: a tribological approach

G Skomedal, E J Øvrelid, S Armada [...]

Proceedings of the Institution of Mechanical Engineers,Part J: Journal of Engineering Tribology

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Research article

First published 2023-10

Profile control processes based on contact types in silicon wafer DSP manufacturing management

Yangjian Li, Liang Zhu, Xuechun Zhang [...]

Proceedings of the Institution of Mechanical Engineers,Part B: Journal of Engineering Manufacture

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Research article

First published 2007-2

The Effect of the Cutting Edge Radius on a Machined Surface in the Nanoscale Ductile Mode Cutting of Silicon Wafer

S Arefin, X P Li, M B Cai [...]

Proceedings of the Institution of Mechanical Engineers,Part B: Journal of Engineering Manufacture

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Research article

First published 2010-9

Applications of Microstructured Silicon Wafers as Internal Reflection Elements in Attenuated Total Reflection Fourier Transform Infrared Spectroscopy

Henrik Schumacher, Ulrich Künzelmann, Boris Vasilev [...]

Applied Spectroscopy

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Research article

First published 2020-3

Development of electrical enhanced photocatalysis polishing slurry for silicon carbide wafer

Yan He, Zewei Yuan, Kai Cheng [...]

Proceedings of the Institution of Mechanical Engineers,Part J: Journal of Engineering Tribology

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Research article

First published 2018-10

Experimental investigation of the governing parameters of the electrostatic field–induced electrolyte jet micro electrical discharge machining on the silicon wafer

Yaou Zhang, Ning Han, Xiaoming Kang [...]

Proceedings of the Institution of Mechanical Engineers,Part B: Journal of Engineering Manufacture

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