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Research article

First published 2006-08

Flow Visualization of Solder Ball Arrangement for Underfill Encapsulation of Flip Chip

Y. K. Shen, P. T. Lin, S. W. Yeh

Journal of Reinforced Plastics and Composites

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Research article

First published 2004-9

Hygrothermal stress analysis of a plastic ball grid array package during solder reflow

K-C Chang, M-K Yeh, K-N Chiang

Proceedings of the Institution of Mechanical Engineers,Part C: Journal of Mechanical Engineering Science

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Research article

First published 2007-9

Study on oxygen contamination during atomisation of solder powders for microelectronics

R. C. Reddy, B. S. Kiran, V. C. Sethi [...]

Powder Metallurgy

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Research article

First published 2011-8

Benefits from condition monitoring techniques: a case study on maintenance scheduling of ball grid array solder joints

M-Y You, F Liu, G Meng

Proceedings of the Institution of Mechanical Engineers,Part E: Journal of Process Mechanical Engineering

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Research article

First published 2009-12

Interfacial reaction and mechanical reliability of eutectic Sn–0·7Cu/immersion Ag-plated Cu solder joint

J.-W. Yoon, S.-B. Jung

Materials Science and Technology

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Research article

First published 2006-1

Growth analysis of interfacial delamination in a plastic ball grid array package during solder reflow using the global–local finite element model

K-C Chang, K-N Chiang

The Journal of Strain Analysis for Engineering Design

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Research article

First published 2025-2

Fatigue life prediction of BGA solder joint of several alloy compositions under an isothermal harmonic vibration

Jihen Rebai, Abdelkhalak El Hami, Sinda Ghenam [...]

Proceedings of the Institution of Mechanical Engineers,Part C: Journal of Mechanical Engineering Science

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Research article

First published 2007-4

Effect of high temperature storage test on reliability of eutectic Sn–Cu/ENIG solder joint

J.-W. Yoon, S.-W. Kim, S.-B. Jung

Materials Science and Technology

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Research article

First published 2011-12

Optimal design of thin-profile fine-pitch ball grid array package under drop impact test

R S Chen, H E Cheng, R W Wu [...]

Proceedings of the Institution of Mechanical Engineers,Part C: Journal of Mechanical Engineering Science

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Research article

First published 2009-12

Microstructures formed from mixed solders on copper substrate

L. Snugovsky, P. Snugovsky, D. D. Perovic [...]

Materials Science and Technology

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