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Research article

First published 2020-5

Manufacturing processes for fabrication of flip-chip micro-bumps used in microelectronic packaging: An overview

Madhav Datta

Journal of Micromanufacturing

Open access

Research article

First published 2023-3

Experimental studies on application of silver paste in thermosonic flip-chip bonding

Hui Yang, Zhengbang Zhan

Journal of Low Frequency Noise,Vibration and Active Control

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Research article

First published 2023-8

Effect of flip-chip bonding parameters on the property of passive UHF RFID tags with screen-printed antenna on fabric

Fenye Meng, Jiyong Hu

Textile Research Journal

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Research article

First published 1998-09

Stacking Technology for a Space Constrained Microsystem

M. Heschel, J. F. Kuhmann, S. Bouwstra [...]

Journal of Intelligent Material Systems and Structures

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Other

First published 2004-03

Analysis of the Mold Filling Process on Flip Chip Package

Y. K. Shen, S. H. Chen, H. C. Lee

Journal of Reinforced Plastics and Composites

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Research article

First published 2005-3

Prototype detector technology for the SCUBA-2 submillimetre bolometer array

A. J. Walton, W Parkes, J. G. Terry [...]

Proceedings of the Institution of Mechanical Engineers,Part N: Journal of Nanomaterials,Nanoengineering and Nanosystems

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Research article

First published 2017-5-23

The optimum design of RAM cell based on the modified-GDI method using Non-dominated Sorting Genetic Algorithm II (NSGA-II)

Ebrahim Abiri, Zobeideh Bezareh, Abdolreza Darabi

Journal of Intelligent & Fuzzy Systems: Applications in Engineering and Technology

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Research article

First published 1996-05

Multi-Freedom Tube Type Manipulator with SMA Plate

Shinji Kaneko, Shinji Aramaki, Kazuhiko Arai [...]

Journal of Intelligent Material Systems and Structures

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Research article

First published 2000-6

“Microflex”—A New Assembling Technique for Interconnects

Thomas Stieglitz, Hansjoerg Beutel, J. -Uwe Meyer

Journal of Intelligent Material Systems and Structures

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