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Research article

First published 2022-11

Simulation analysis method of expandable and flexible sensor networks based on the flexible printed circuit process

Shuguang Hu, Yu Wang, Tao Xiong [...]

Structural Health Monitoring

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Research article

First published 2010-6

Design and construction of large-area flexible printed-circuit automotive electrical interconnection harnesses

D P Webb, W A Jaggernauth, M C W Cottrill [...]

Proceedings of the Institution of Mechanical Engineers,Part D: Journal of Automobile Engineering

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Research article

First published 2004-7

Electromagnetic compatibility performance of large area flexible printed circuit automotive harness

D P Webb, W A Jaggernauth, M W C Cottrill [...]

Proceedings of the Institution of Mechanical Engineers,Part D: Journal of Automobile Engineering

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Research article

First published 2017-7

Design of a smart ECG garment based on conductive textile electrode and flexible printed circuit board

Zhipeng Cai, Kan Luo, Chengyu Liu [...]

Technology and Health Care

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Research article

First published 2009-04

Organo-Soluble Low CTE Polyimides and their Applications to Photosensitive Cover Layer Materials in Flexible Printed Circuit Boards

Junichi Ishii, Tadashi Akamatsu

High Performance Polymers

Free access

Case report

First published 2017-1

Vision-based calibration/compensation technique for automatic stiffener bonder

Su Ye, Yutang Ye, Yu Xie [...]

Proceedings of the Institution of Mechanical Engineers,Part B: Journal of Engineering Manufacture

Open access

Research article

First published 2020-3

A lamination-based piezoelectric insole gait analysis system for massive production for Internet-of-health things

Yanning Dai, Yuedong Xie, Junliang Chen [...]

International Journal of Distributed Sensor Networks

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Research article

First published 2026-3

Design and implementation of a digital smart layer for ultrasonic-guided wave-based structural health monitoring

Juntao Wei, Lingyu Sun, Chang Peng [...]

Structural Health Monitoring

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Research article

First published 2006-10

Poly(ester imide)s Possessing Low Coef-cient of Thermal Expansion and Low Water Absorption

Masatoshi Hasegawa, Kazunori Koseki

High Performance Polymers

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Research article

First published 2005-06

Setup Time Reduction for Electronics Assembly: Combining Simple (SMED) and IT‐Based Methods

Sheri Coble Trovinger, Roger E. Bohn

Production and Operations Management

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