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Articles (62)

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1-10 of 62 results for CU-NI-SN

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Select article: Morphology and chemical composition of Cu/Sn/Cu and Cu(5 at-%Ni)/Sn/Cu(5 at-%Ni) interconnections

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Research article

First published 2012-1

Morphology and chemical composition of Cu/Sn/Cu and Cu(5 at-%Ni)/Sn/Cu(5 at-%Ni) interconnections

A Wierzbicka-Miernik, J Wojewoda-Budka, L Litynska-Dobrzynska [...]

Science and Technology of Welding and Joining

Select article: Phase equilibria in Sn rich corner of Cu–Ni–Sn system

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Research article

First published 2006-8

Phase equilibria in Sn rich corner of Cu–Ni–Sn system

L. Snugovsky, P. Snugovsky, D. D. Perovic [...]

Materials Science and Technology

Select article: Formation of microstructure resulting from quasi-peritectic reactions during freezing of Bi–Pb–Sn and Cu–Ni–Sn ternary alloys

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Research article

First published 2008-2

Formation of microstructure resulting from quasi-peritectic reactions during freezing of Bi–Pb–Sn and Cu–Ni–Sn ternary alloys

L. Snugovsky, P. Snugovsky, D. D. Perovic [...]

Materials Science and Technology

Select article: Microstructure and bond strength of Ni–Cr steel/Al 2 O 3 joints brazed with Ag–Cu–Zr alloys containing Sn or Al

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Research article

First published 1999-11

Microstructure and bond strength of Ni–Cr steel/Al 2 O 3 joints brazed with Ag–Cu–Zr alloys containing Sn or Al

Y.C. Yoo, J.H. Kim, K. Park

Materials Science and Technology

Select article: Investigation of interfacial reaction between eutectic Sn–Pb solder droplet and Au/Ni/Cu pad

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First published 2008-6

Investigation of interfacial reaction between eutectic Sn–Pb solder droplet and Au/Ni/Cu pad

F. Q. Li, C. Q. Wang, Y. H. Tian

Materials Science and Technology

Select article: Comparison of spreading behaviour and interfacial microstructure in Sn–0·7Cu,Sn–0·3Ag–0·7Cu and Sn–2·5Ag–0·5Cu lead free solder alloys on Fe–42Ni substrate

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Research article

First published 2013-4

Comparison of spreading behaviour and interfacial microstructure in Sn–0·7Cu,Sn–0·3Ag–0·7Cu and Sn–2·5Ag–0·5Cu lead free solder alloys on Fe–42Ni substrate

S Narayan, K N Prabhu

Materials Science and Technology

Select article: Effects of in situ nickel particle addition on the microstructure and microhardness of Sn–Ag solder

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Research article

First published 2005-6

Effects of in situ nickel particle addition on the microstructure and microhardness of Sn–Ag solder

H. T. Lee, Y. H. Lee

Science and Technology of Welding and Joining

Select article: Effect of high temperature storage test on reliability of eutectic Sn–Cu/ENIG solder joint

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Research article

First published 2007-4

Effect of high temperature storage test on reliability of eutectic Sn–Cu/ENIG solder joint

J.-W. Yoon, S.-W. Kim, S.-B. Jung

Materials Science and Technology

Select article: Creep by Grain-Boundary Mass Transport in Binary Copper Alloys

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Research article

First published 1975-1

Creep by Grain-Boundary Mass Transport in Binary Copper Alloys

I. G. Crossland, B. Burton, B. D. Bastow

Materials Science and Technology

Select article: Effect of Ni on growing of intermetallic compound in interface of Sn2·5Ag0·7Cu0·1RE/Cu solder joint during aging

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Research article

First published 2012-6

Effect of Ni on growing of intermetallic compound in interface of Sn2·5Ag0·7Cu0·1RE/Cu solder joint during aging

K K Zhang, C Y Li, R F Qiu [...]

Materials Science and Technology

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