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Articles (32)

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1-10 of 32 results for BI-PB-SN

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Select article: Formation of microstructure resulting from quasi-peritectic reactions during freezing of Bi–Pb–Sn and Cu–Ni–Sn ternary alloys

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Research article

First published 2008-2

Formation of microstructure resulting from quasi-peritectic reactions during freezing of Bi–Pb–Sn and Cu–Ni–Sn ternary alloys

L. Snugovsky, P. Snugovsky, D. D. Perovic [...]

Materials Science and Technology

Select article: Formation of microstructure during solidification of Bi–Pb–Sn ternary eutectic

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First published 1999-10

Formation of microstructure during solidification of Bi–Pb–Sn ternary eutectic

M.A. Ruggiero, J.W. Rutter

Materials Science and Technology

Select article: Origin of microstructure in Bi–Pb and Bi–Sn binary eutectics

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First published 1997-7

Origin of microstructure in Bi–Pb and Bi–Sn binary eutectics

S. D. Bagheri, J. W. Rutter

Materials Science and Technology

Select article: Surface tension of some Sn–Pb alloys: Part 1 Effect of Bi,Sb,P,Ag,and Cu on 60Sn–40Pb solder

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Research article

First published 1987-12

Surface tension of some Sn–Pb alloys: Part 1 Effect of Bi,Sb,P,Ag,and Cu on 60Sn–40Pb solder

M. A. Carroll, M. E. Warwick

Materials Science and Technology

Select article: Effect of compositional changes and impurities on wetting properties of eutectic Sn–Bi alloy used as solder

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Research article

First published 1985-3

Effect of compositional changes and impurities on wetting properties of eutectic Sn–Bi alloy used as solder

C. A. MacKay, W. D. von Voss

Materials Science and Technology

Select article: Variation of as-cast grain structure vvith composition in eutectic systems

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First published 1986-2

Variation of as-cast grain structure vvith composition in eutectic systems

S. Chiba, J.A. Spittle

Materials Science and Technology

Select article: Interrelation of wettability–microstructure–tensile strength of lead-free Sn–Ag and Sn–Bi solder alloys

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Research article

First published 2016-8

Interrelation of wettability–microstructure–tensile strength of lead-free Sn–Ag and Sn–Bi solder alloys

Wislei R. Osório, Amauri Garcia

Science and Technology of Welding and Joining

Select article: High-strength Sn–Bi-based low-temperature solders with high toughness designed via high-throughput thermodynamic modelling 1

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Research article

First published 2022-10

High-strength Sn–Bi-based low-temperature solders with high toughness designed via high-throughput thermodynamic modelling 1

Chih-han Yang, Yu-chen Liu, Yuki Hirata [...]

Science and Technology of Welding and Joining

Select article: Metallurgy of low temperature Pb-free solders for electronic assembly

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Research article

First published 1995-1

Metallurgy of low temperature Pb-free solders for electronic assembly

J. Glazer

International Materials Reviews

Select article: A Spectrochemical Method for the Determination of Trace Impurities in Metallurgical Materials

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First published 1966-5

A Spectrochemical Method for the Determination of Trace Impurities in Metallurgical Materials

B. E. Balfour, D. Jukes, K. Thornton

Applied Spectroscopy

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