Abstract
The finite element analysis method was used to obtain values of the von Mises equivalent stress (SEQV) at selected locations within the adhesive layer of two-dimensional models of bonded orthodontic brackets. In all, 39 model cases were analyzed involving 4 overall bracket configurations, 3 combinations of materials of fabrication of the bracket, 3 types of debonding forces and 4 adhesives. The results are presented to show the sensitivity of SEQV to each of the parameters studied. Comments are made on the usefulness of the results in the development of a standard protocol for experimental determination of the bond strength of adhesives used in securing orthodontic brackets.
Get full access to this article
View all access options for this article.