Flow and heat transfer of the axisymmetric stagnation flow passing through irregular wafer

Abstract

A theoretical model for the two-dimensional, incompressible, and steady-state laminar forced convective flow over the irregular wafer is examined. Starting from the full Navier—Stokes equations and converting this into the boundary layer equations by the simple coordinate transformation. The resulting parabolic equations are solved using the cubic spline approximation. The numerical result shows that the local flow and local heat transfer characters of a wafer surface are greatly affected by the tiny concaves and convexes on the surface and have a frequency similar to that of surface geometry. The effect becomes obvious with the increase of radius, whereas the mean heat transfer efficiency remains slightly less than that of flat wafer.