Numerical modelling of defect formation on copper wire surfaces during the wire drawing process

Abstract

Abstract

The crowsfoot defect, a characteristic surface cracking defect in wire drawing, usually occurs at fine wire diameters. This paper reports a numerical simulation of the wire drawing process where copper wire is reduced in diameter under varying conditions of friction, die angle and reduction ratios. The results of this analysis show that, contrary to existing theoretical models, the largest drawing stress and von Mises equivalent stress occur at the outer surface of the wire and not along the central axis as previously postulated.