In the past decade, the optical method called moire interferometry has matured rapidly to emerge as an invaluable tool, proved by many industrial and scientific applications. It has been applied to numerous problems in engineering mechanics. It measures in-plane displacement fields with high sensitivity and high spatial resolution. This paper reviews current practices of moire interferometry and its extensions. Applications in diverse fields are addressed to demonstrate the wide applicability of the method, especially the recent applications for thermal deformation analyses of microelectronics devices. Speculation on future developments and practices is presented.
PostD.HanB.IfjuP.High Sensitivity Moire: Experimental Analysis for Mechanics and Materials, 1994 (Springer-Verlag, New York).
2.
McDonachA.McKelvieJ.WalkerC. A.Stress analysis of fibrous composites using moire interferometryOptics Lasers Engng, 1980, 1 (2), 185–205.
3.
HyerW. M.HerakovichC. T.PostD.Thermal expansion of graphite epoxy. In 1982Advances in Aerospace Structures and Materials, 1982, pp. 107–114 (American Society of Mechanical Engineers, New York).
4.
WoodJ. D.Detection of delamination onset in a composite laminate using moire interferometryComposite Technol. Rev., 1985, 7 (4), 121–128.
PostD.MortonJ.WangY.DaiF. L.Interlaminar compression of a thick composite. In Proceedings of the Fourth Annual Meeting of the American Society for Composites, 1989, pp. 101–106.
7.
PostD.GuoY.CzarnekR.Deformation analysis of boron/aluminium specimens by moire interferometry In Metal Matrix Composites: Testing Analysis, and Failure Modes, ASTM STP 1032 (Ed. JohnsonW. S.), 1989, pp. 161–170 (American Society for Testing and Materials, Philadelphia, Pennsylvania).
8.
PostD.Moire interferometry for composites In Manual on Experimental Methods for Mechanical Testing of Composites (Eds PendletonR. L.TuttleM. E.), 1989, pp. 67–80 (Society for Experimental Mechanics, Bethel, Connecticut).
9.
TuttleM. E.GraesserD. L.Compression creep of graphite/epoxy laminates monitored using moire interferometryOptics Lasers Engng, 1990, 12 (2), 151–172.
10.
GascoigneH. E.AbdallahM. G.Strain analysis of a bonded dissimilar, composite material T-joint using moire interferometryOptics Lasers Engng, 1990, 13, 155–165.
11.
BoemanR. G.Interlaminar deformations on the cylindrical surface of a hole in laminated composites: an experimental study. Center for Composite Materials and Structures Report 91–07, Virginia Polytechnic Institute and State University, Blacksburg, Virginia, 1991.
12.
GascoigneH. E.AbdallahM. G.Displacements and strains in thick-walled composite rings subjected to external pressure using moire interferometry. In Proceedings of the Second International Conference onPhotomechanics and Speckle Metrology Proceedings of the SPIE, Vol.1554B, 1991, pp. 315–322 (Society of Photo-optical Instrumentation Engineers, Bellingham, Washington).
13.
GuoY.PostD.HanB.Thick composites in compression: An experimental study of micromechanical behavior and smeared engineering propertiesJ. Composite Mater., 1992, 26 (13), 1930–1944.
14.
MastersJ. E.FedroM. J.IfjuP. G.Experimental and analytical characterization of triaxially braided textile composite materials. In Proceedings of the Third NASA Advanced Composites Technology Conference, NASA CP-3178, Long Beach, California, 1992, pp. 263–285.
15.
IfjuP. G.MastersJ. E.JacksonW. C.Using moire interferometry to aid in standard test method development for textile composite materialsComposites Sci. Technol., 1995, 53, 155–163.
16.
IfjuP. G.Shear testing of textile composite materialsASTM J. Composites Technol. Res., July 1995, 17 (3), 199–204.
17.
RheeJ.HeS.RowlandsR. E.Hybrid moire-numerical stress-analysis around cutouts in loaded compositesExpl Mechanics, 1996, 36, 379–387.
18.
MollenhauerD. H.Interlaminar deformation at a hole in laminated composites: a detailed experimental investigation using moire interferometry. PhD Dissertation, Virginia Polytechnic Institute and State University, Blacksburg, Virginia, 1997; available for download at http://scholar.lib.vt.edu/theses/theses.html.
19.
HanB.Micromechanical deformation analysis of beta alloy titanium in elastic and elastic/plastic tensionExpl Mechanics, 1996, 36, 120–126.
20.
ParkS. B.ParkS. S.CarmanG. P.HahnH. T.Measuring strain distribution during mesoscopic domain reorientation in a ferroelectric materialJ. Engng Mater. Technol., 1998, 120, 1–6.
21.
PostD.CzarnekR.SmithC. W.Patterns of U and V displacement fields around cracks by moire interferometry In Application of Fracture Mechanics to Materials and Structures (Eds SihG. C.SommerE.DehlW.), 1984, pp. 699–708 (Martinus Nijhoff, Boston, Massachusetts).
22.
SmithC. W.Measurements of three-dimensional effects in fracture mechanics In Fracture Mechanics (19th Conference), ASTM STP 969, 1988, pp. 5–18 (American Society for Testing and Materials, Philadelphia, Pennsylvania).
23.
DadkhahM. S.KobayashiA. S.HRR field of a moving crack, an experimental analysisEngng Fracture Mechanics, 1989, 34, 253–262.
24.
NicolettoG.Moire interferometric fringe patterns about crack tips: Experimental observations and numerical simulationsOptics Lasers Engng, 1990, 12 (2), 135–150.
25.
EpsteinJ. S.JungH. Y.ReuterW. G.Stress intensity factor extraction using moire interferometry based on a 2-parameter displacement eigenfunction—validity criteria and comparison with ASTM E-399 K plane strain test methodsOptics Lasers Engng, 1990, 13, 167–180.
26.
EpsteinJ. S.DadkhahM. S.Moire interferometry in fracture mechanics In Experimental Techniques in Fracture, Vol. Ill (Ed. EpsteinJ. S.), 1993, pp. 427–508 (VHC Publishers, New York).
PerryK. E.McKelvieJ.Measurement of energy release rates for delaminations in composite materialsExpl Mechanics, 1996, 36, 55–63.
29.
WoodJ. D.WangR. Z.WeinerS.PashleyD. H.Mapping of deformation caused by moisture change using moire interferometryDent. Mater., May 1999 (submitted).
30.
WalkerC. A.McDonachA.MacKenzieP.McKel-VieJ.Dynamic moire measurement of strains induced in a titanium tube plate during rolling of a series of tubesExpl Mechanics, 1985, 25 (1), 1–5.
31.
MortonJ.PostD.HanB.TsaiM. Y.A localized hybrid method of stress analysis: A combination of moire interferometry and FEMExpl Mechanics, 1990, 30 (2), 195–200.
32.
CzarnekR.PostD.Moire interferometry with ±45° gratings applied to the dovetail joint. In Proceedings of 1985 SEM Spring Conference onExperimental Mechanics, 1985, pp. 553–559 (Society for Experimental Mechanics, Bethel, Connecticut).
33.
ChavezS. A.DeasonV. A.EpsteinJ. S.Use of moire interferometry in weldments. In Proceedings of the International Conference onTrends in Welding Research (Ed. DavidS. A.), 1986, pp. 533–537 (American Society for Metals, Metals Park, Ohio).
34.
PostD.CzarnekR.WoodJ. D.JohD.Deformations and strains in a thick adherend lap joint In Adhesively Bonded Joints: Testing, Analysis and Design, ASTM STP 981 (Ed. JohnsonW. S.), 1988, pp. 107–118 (American Society for Testing and Materials, Philadelphia, Pennsylvania).
35.
PostD.WoodJ. D.HanB.ParksV. J.GerstleF. P.JrThermal stresses in a bimaterial joint: An experimental analysisJ. Appl. Mechanics, 1994, 61 (1), 192–198.
NicolettoG.Theoretical fringe analysis for a coherent optics method of residual stress measurementJ. Strain Analysis, 1988, 23, 169–178.
39.
NicolettoG.Moire interferometry determination of residual stresses in the presence of gradientsExpl Mechanics, 1991, 31 (3), 252–256.
40.
WuZ.LuJ.HanB.Study of residual stress distribution by a combined method of moire interferometry and incremental hole drilling. Part I: TheoryJ. Appl. Mechanics, 1998, 65, 837–843.
41.
WuZ.LuJ.HanB.Study of residual stress distribution by a combined method of moire interferometry and incremental hole drilling. Part II: ImplementationJ. Appl. Mechanics, 1998, 65, 844–850.
42.
IfjuP.NiuX.KildayB.LiuS.-C.EttingerS.Residual strain measurement in composites using the cure-referencing methodExpl Mechanics, 2000, 40 (1), 22–30.
43.
WatsonR. B.PostD.Precision strain standard by moire interferometry for strain gage calibrationExpl Mechanics, 1982, 22 (7), 256–261.
BastawrosA. F.VoloshinA. S.Thermal strain measurements in electronic packages through fractional fringe moire interferometryTrans. ASME, J. Electronic Packaging, 1990, 112 (4), 303–308.
47.
GuoY.ChenW. T.LimC. K.Experimental determination of thermal strains in semiconductor packaging using moire interferometry. In Proceedings of the 1992 Joint ASME-JSME Conference onElectronic Packaging, 1992, pp. 779–784 (American Society of Mechanical Engineers, New York).
48.
WuT. Y.GuoY.ChenW. T.Thermal-mechanical strain characterization for printed wiring boardsIBM J. Res. Dev., 1993, 37 (5), 621–634.
49.
GuoY.LimC. K.ChenW. T.WoychikC. G.Solder ball connect (SBC) assemblies under thermal loading. I: Deformation measurement via moire interferometry, and its interpretationIBM J. Res. Dev., 1993, 37 (5), 635–648.
50.
HanB.GuoY.Thermal deformation analysis of various electronic packaging products by moire and microscopic moire interferometryTrans. ASME, J. Electronic Packaging, 1995, 117, 185–191.
51.
TsaoP. H.VoloshinA. S.Manufacturing stresses in the die due to die-attach processIEEE Trans. Components, Packaging Mfg Technol. A, 1995, 18 (1), 201–205.
52.
HanB.GuoY.LimC. K.CaletkaD.Verification of numerical models used in microelectronics packaging design by interferometric displacement measurement methodsTrans. ASME, J. Electronic Packaging, 1996, 118, 157–163.
53.
HanB.GuoY.Determination of effective coefficient of thermal expansion of electronic packaging components: A whole-field approachIEEE Trans. Components, Packaging Mfg Technol. A, 1996, 19 (2), 240–247.
54.
HanB.ChopraM.ParkS.LiL.VermaK.Effect of substrate CTE on solder ball reliability of flip-chip PBGA package assemblyJ. Surf. Mount Technol., 1996, 9, 43–52.
55.
HanB.Deformation mechanism of two-phase solder column interconnections under highly accelerated thermal cycling condition: An experimental studyTrans. ASME, Electronic Packaging, 1997, 119, 189–196.
56.
HanB.GuoY.Photomechanics tools as applied to electronic packaging product development In Experimental/Numerical Mechanics in Electronics Packaging, Vol. 1 (Eds HanB.MahajanR.BarkerD.), 1997, pp. 11–15 (Society for Experimental Mechanics, Bethel, Connecticut).
57.
HanB.Recent advancement of moire and microscopic moire interferometry for thermal deformation analyses of microelectronics devicesExpl Mechanics, 1998, 38 (4), 278–288.
58.
VoloshinA. S.TsaoP. H.PearsonR. A.In situ evaluation of residual stresses in an organic die-attach adhesiveTrans. ASME, Electronic Packaging, 1998, 120 (3), 314–318.
59.
HanB.KunthongP.Micro-mechanical deformation analysis of surface laminar circuit in organic flip-chip package: An experimental studyTrans. ASME, Electronic Packaging, 2000, 122 (4), 294–300.
60.
PatorskiK.Handbook of the Moire Fringe Techniques, 1993 (Elsevier, New York).
61.
CloudG.Optical Methods of Engineering Analysis, 1995 (Cambridge University Press, Cambridge).
62.
LivnatA.PostD.The governing equations of moire interferometry and their identity to equations of geometric moireExpl Mechanics, 1985, 25 (4), 360–366.
PostD.WoodJ.Determination of thermal strains by moire interferometryExpl Mechanics, 1989, 29 (3), 318–322.
68.
TsukadaY.Solder bumped flip chip attach on SLC board and multi-chip module In Chip on Board (Ed. LauJ. H.), 1994, Ch. 9, pp. 410–443 (Van Nostrand Reinhold, New York).
DandlikerR.ThalmannR.Heterodyne and quasi-heterodyne holographic interferometryOpt. Engng, 1985, 24 (5), 824–831.
72.
BrownellJ. B.ParkerR. J.Automated fringe analysis for moire interferometry. In Proceedings of the Second International Conference onPhotomechanics and Speckle Metrology, Proceedings of the SPIE, Vol.1554B, 1991, pp. 481–492 (Society of the Photo-optical Instrumentation Engineers, Bellingham, Washington).
PerryK. E.McKelvieJ.A comparison of phase shifting and Fourier methods, in the analysis of discontinuous fringe patternsOptics Lasers Engng, 1993, 19, 269–284.
75.
HuntleyJ. M.Automated fringe pattern analysis in experimental mechanics: A reviewJ. Strain Analysis, 1998, 33, 105–126.
