Sequential deposition and electroforming of metal–ceramic composites for thermal management applications

Abstract

Three approaches for the fabrication of ceramic–metal composites for thermal management of electronic circuitry are studied both theoretically and experimentally. The first approach includes the fabrication of Cu/Al₂O₃ coatings by the sequential electrophoretic deposition (EPD) – electroplating method. The kinetics of EPD, suspension stability are analysed. The SEM characterisation of the produced deposits shows good bonding between Al₂O₃ inclusions and copper matrix. An alternative approach includes the electroforming of copper ‘rivets’ on plastic substrate and on a porous SiC skeleton. The residual stress distribution at the ceramic/metal interface was simulated using finite element analysis. The third approach involves the fabrication of metal–ceramic foams as a basis for integrated thermal sinks. Copper–silicon carbide foam is considered as a model and experimental system for this approach. The modelling results provide recommendations on the optimal thicknesses of the deposited ceramic and metal layers to achieve the best heat conductivity with minimal thermal expansion mismatch.