New epoxy-imide resins cured with N-(3-hydroxyphenyl)trimellitimide: synthesis,thermal and adhesive properties

Abstract

N-(3-hydroxyphenyl)trimellitimide (NHPTI) was synthesised through the reaction of m-aminophenol and trimellitic acid anhydride. Then epoxy-imide resins were prepared by curing the epoxy resin (CYD-128: DGEBA) with NHPTI. The curing reaction of NHPTI and CYD-128 was investigated by the methods of FTIR, DSC, etc. It was found that the esterification reaction had occurred between the epoxy and the phenyl carboxyl or hydroxyl groups of NHPTI. Moreover, the curing reaction could be accelerated by 2-ethyl-4-methylimidazole (2-MZ) as a catalyst. The cured epoxy-imide resins showed good thermal stability and adhesive properties. Thermogravimetric analysis indicated that the imide groups incorporated could have a profound effect on increasing char yield and on thermal degradation temperatures.

Keywords

N-(3-HYDROXYPHENYL)TRIMELLITIMIDE EPOXY-IMIDE THERMAL STABILITY ADHESIVE PROPERTIES

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