The characterisation of thermal expansion coefficient and thermal conductivity of Al–Si matrix alloy and Al–Si alloy reinforced with fine SiCp (5 and 20 wt-%) composites fabricated by stir casting process are investigated. The results show that with increasing temperature up to 350°C, thermal expansion of composites increases and slowly reduces when the temperature reaches to 500°C. The values of both thermal expansion and conductivity of composites are less than those for Al–Si matrix. Microstructure and particles/matrix interface properties play an important role in the thermal properties of composites. Thermal properties of composites are strongly dependent on the weight percentage of SiCp.
