Gold soldering in microelectronic products with tin

Abstract

The results of research into the interaction of 0.04 mm diameter gold microwire with STI50 solder have been presented when soldering hybrid integrated circuits and microassemblies on printed boards. The dependence of dissolving of gold wire on the temperature and duration of soldering has been established as well as on holding time at a seam temperature of 100 ° C; the interaction of STI50 solder with gold coating on UHF and HIC boards has been considered when soldering on metallic substrates.

Keywords

COATING INTERMETALLIC WELDING

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Gold soldering in microelectronic products with tin–indium solder

Abstract

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