Abstract
The effect of a direct electric current on the wetting behaviour of eutectic SnBi melt on Cu substrate at 220°C was investigated in the present study. It is found that the application of current enhanced the growth rate and lateral growth of interfacial reaction layer between eutectic SnBi melt and Cu substrate. Furthermore, with the increase in the current, the spread of eutectic SnBi melt on Cu is accelerated significantly and the steady state contact angle is decreased markedly. The reason for these is also discussed in the present paper.
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