Tensile and dynamic mechanical properties of thin film epoxy composites containing different types of fillers such as synthetic diamond (SD), silicon nitride, and boron nitride (BN) were investigated. The filler contents were varied between 0 and 2 vol.%. Spin coating technique was employed to produce thin film with thickness of 40–60 µm. Tensile test results show that addition of SD obviously improves the strength and Young's modulus, and increases the storage modulus (E′) of the epoxy thin film composite. The addition of 2 vol.% SD increases the Young's modulus and tensile strength by almost two times the properties of neat epoxy. Scanning electron microscopy showed void formation and poor interfacial analysis which explains the reduced tensile strength of BN filler epoxy composites.
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