The silicon-containing epoxy/clay nanocomposites were developed by incorporating the surface-modified MMT clay upto 7wt% into Si-epoxy resin. The surface of the montmorillonite (MMT) clay was modified with two surface modifiers namely cetyltrimethylammonium bromide (CTAB) and 3-aminopropyltriethoxysilane (γ-APS). The surface modified clay reinforced Si-epoxy composites were developed in the form of castings, and were characterized for their thermal and mechanical properties. Thermal behaviour of the composites was characterized by differential scanning calorimetry (DSC), thermo gravimetric analysis (TGA) and dynamic mechanical analysis (DMA). Mechanical properties were studied as per ASTM standards. Data result from the different studies, it is inferred that the surface modified clay reinforced Si-epoxy composites exhibit lower Tg than that of neat epoxy matrix (127°C <165°C). The decomposition temperature for 60% weight loss of clay reinforced Si-epoxy composites is 674–823°C which is higher when compared to that of neat epoxy matrix. For 5wt% clay reinforced Si-epoxy composites, the values of tensile, flexural and impact strength are increased to 26%, 21% and 29% respectively. The storage modulus (E’) is increased from 5932 to 6308 MPa for clay reinforced Si-epoxy resin. XRD analysis confirmed the well-dispersed exfoliated nanocomposites structure.
Henry; LeeHand book of Epoxy Resins; Mc Graw-Hill, 1967.
2.
ClaytonA.Epoxy Resins: Chemistry and Technology; Marcel Dekker, 1988.
3.
KornmannX., ThomannR., MulhauptR., FinterJ., and BerglundL.A.High Performance epoxy-layered silicate nanocomposites. Polym Eng Sci2002; 42(9), 1815–1826.
4.
KimWG, and NamT.Y.Curing characteristics of o-cresol novolac epoxy resin modified by bismaleimide. J Polym Sci Part A: Polym Chem1996; 34, 957–962.
5.
MustoP., MartuscelliE., RagostaG., RussoP., and ScarinziG.An interpenetrated system based on a tetrafunctional epoxy resin and a thermosetting bismaleimide: Structure-properties correlation. J Appl Polym Sci1998; 69, 1029–1042.
6.
AgagT., and TakeichiT.Synthesis and characterization of epoxy film cured with reactive polyimide. Polymer1999; 40, 6557–6563.
7.
WangW.J., PerngL.H., HsiueG.H., and ChangF.C.Characterization and properties of new silicone containing epoxy resin. Polymer2000; 41, 6113–6122.
8.
HsiueG.H., WangW.J., and ChangF.C.Synthesis, characterization, thermal and flame-retardant properties of silicon-based epoxy resins. J Appl Polym Sci1999; 73, 1231–1238.
KishidaS., and IjiM.Proceedings of International Conference on Halogen free Materials for Electronic and Electrical Products, Gothenburg, Sweden; November 27–28; 1999; Chapter 20.
15.
HsiueG.H., LiuY.L., and TsiaoJ.Phosphorus-containing epoxy resins for flame retardancy V: Synergistic effect of phosphorus-silicon on flame retardancy. J Appl Polym Sci2000; 78, 1–7.
16.
HsiueG.H., LiuY.L., and LiaoH.H.Flame-retardant epoxy resins: An approach from organic-inorganic hybrid nanocomposites. J Polym Sci Part A: Polym Chem2001; 39, 986–996.
17.
ParkS.J., JinF.L., and LeeJ.R.Synthesis and Characterization of a Novel Silicon-containing Epoxy Resin. Macromol Res2005; 13, 8–13, 2005.
18.
WuC.S., LiuY.L., and ChiuY.S.Epoxy resins possessing flame retardant elements from silicon incorporated epoxy compounds cured with phosphorus or nitrogen containing curing agents. Polymer2002; 43, 4277–4284.
19.
HaS.R., RyuS.H., ParkS.J., and RheeK.Y.Effect of clay surface modification andconcentration on the tensile performance of clay/epoxy nanocomposites. Mater Sci Eng: A2007; 448, 264–268, 2007.
20.
DinakaranK., and AlagarM.Preparation and Characterization of Epoxy-Cyanate Ester Interpenetrating Network Matrices/Organoclay Nanocomposites. Polym Adv Technol2003; 14, 574–585.
21.
KhanbabaeiG., AalaieJ., RahmatpourA., Khoshniyat A and Gharabadian, MA. J Macromol Sci Part B: Phy2007; 46, 975–986.
YasminA., AbotJ.L., and DanielI.M.Compounding of nanoclay/epoxy composites with a three-roll mill. Mater Res Soc Proc2003; 740, 75–80.
24.
LiuW., HoaS.V., and PughM.Organoclay modified high performance epoxy nanocomposites. Compos Sci Technol2005; 65, 307–316.
25.
YasminA., AbotJ.L., and DanielI.M.Processing of clay/epoxy nanocomposites by shear mixing. Script Mater2003; 49, 81–86.
26.
VelmuruganR., and MohanT.P.Room temperature processing of epoxy-clay nanocomposites. J Mater Sci2004; 39, 7333–7339.
27.
SunR., YaoH., ZhangHB., LiY., MaiYW., YuZZ. Decoration of defect free graphene nanoplatelets with alumina for thermally conductive and electrically insulating epoxy nanocomposites. Compos. Sci. Technol., 2016, 137, 16–23.
28.
TsaiYT., ChiouJU., LiaoCY., ChenPY., TungS.H., LinJJ. Organoclay modified clay as rheology modifiers and dispersing agents for epoxy packing of white LEDCompos. Sci. Technol., 2016, 132, 9–15.
29.
LiawD.J., and LiawB.Y.Synthesis and characterization of novel polyaryloxydiphenylsilane derived from 2,2'-dimethyl-biphenyl-4,4'-diol. J Polym Sci Part A: Poly Chem1999; 37, 4591–4595.
30.
CurryJ.E., and ByrdJ.D.Silane polymers of diols. J Appl Polym Sci1965; 9, 295–311.
31.
DunnavantW.R., MarkleR.A., CurryJ.E., and ByrdJ.D.Synthesis of polyaryloxysilanes by melt-polymerizing dianilino- and diphenoxysilanes with aromatic diols. J Polym Sci. Part A: Poly Chem1967; 5, 707–724.
ChanderR., RajabiL., and SoniR.K.The effect of bismaleimide resin on curing kinetics of epoxy-amine thermosets. J Appl Polym Sci1996; 62, 661–671, 1996.
40.
BanksM., EbdonJ.R., and JohnsonM.The flame retardant effect of diethyl vinyl phosphonate in copolymers with styrene, methyl methacrylate, acrylonitrile and acrylamide. Polymer., 35, 3470–3473, 1994.
41.
LiuYL., HsiueGH., LeeRH., ChiuYS., Phosphorus-containing epoxy for flame retardant. III: Using phosphorylated diamines as curing agents. J Appl Polym Sci., 63, 895–901, 1997.
