Knowledge of the long-term performance of building envelopes subjected to simultaneous heat and moisture transport is critical during the design stage. A number of simulation models that can be used to analyse the combined heat and moisture behaviour of building structures have recently been developed. This, however, is not a straightforward task. A general approach to hygrothermal analysis is presented in this paper. The method is applied for a case of a wood frame wall design, evaluating the risk for mould growth within the construction.
PedersenC.R.1990. Combined heat and moisture transfer in building constructions. Ph.D. Thesis, Thermal Insulation Laboratory, Technical University of Denmark, Lyngby, Denmark.
4.
HagentoftC.-E.1993. PC-program 1D-HAM. Calculates the moisture conditions, the temperature and the heat flow in a wall with multi layers. Report TVBH-7147, Lund University, Department of Building Physics, Sweden.
5.
GevingS.1997. Moisture design of building constructions. Hygrothermal analysis using simulation models. Ph.D. Thesis, Department of Building and Construction Engineering, The Norwegian University of Science and Technology, Trondheim, Norway.
6.
ViitanenH.1994. “Factors affecting the development of biodeterioration in wooden constructions.”Materials and Structures, 27, pp. 483–493.
7.
SiemesA.J.M.1996. “Framework for a procedure for design for durability.”Proceedings of the 7th International Conference on the Durability of Building Materials and Components, Stockholm, May.
8.
TolstoyN.1993. “Humidity levels in the Swedish housing stock.”Indoor Air 1993, 4–8 July 1993, Helsinki, Finland.
9.
KumaranM.K.1996. Final Report Task 3: Material properties. IEA, Annex 24 HAMTIE. Laboratorium Bouwfysica, K.U.-Leuven, Belgium.
10.
PressW.H.FlanneryB.P.TeukolskyS.A.VetterlingW.T.. 1996. Numerical recipes. The art of scientific computing. Cambridge University Press, New York.
RubinsteinR.Y.1981. Simulation and the Monte Carlo method. Wiley, New York.
13.
BombergM.AllenD.1996. “Use of generalized limits state method in design of building envelopes for durability.”J. of Thermal Ins. and Bldg. Envelopes, vol. 20, July, pp. 18–39.