In this article, an integrated thermopile vacuum gauge with an XeF2 dry-etching process is presented. The integrated thermopile vacuum gauge consists of an N-polysilicon heater and 38 N-polysilicon/Al thermocouples. By using XeF2 front-side isotropic post-etching technique, the integrated vacuum gauge structure was released, and a small size of the integrated thermopile vacuum gauge structure about 0.4 × 1.5 mm2 has been achieved. Compared with applying a constant voltage to the integrated thermopile vacuum gauge, applying a constant power to the gauge is more sensitive. The experimental results show that the dynamic pressure range of the integrated thermopile vacuum sensor is 10−2–105 Pa.
MitchellJLahijiGRNajafiK. An improved performance poly-Si Pirani vacuum gauge using heat-distributing structural supports. J Microelectromech S2008; 17(1): 93–102.
2.
LiQGoosenJFLvan BeekJTM. A SOI Pirani sensor with triple heat sinks. Sensor Actuat A: Phys2010; 162(2): 267–271.
3.
Van HerwaardenAWSarroPM. Integrated vacuum sensor. Sensor Actuator1985; 8: 187–196.
4.
Van HerwaardenAWvan DuynDCGroenewegJ. Small-size vacuum sensors based on silicon thermopiles. Sensor Actuat A: Phys1991; 25–27: 565–569.
5.
VolkleinFBlumersMSchmittL. Thermoelectric microsensors and microactuators (MEMS) fabricated by thin film technology and micromachining. In: Proceedings of the 18th international conference on thermoelectrics, Baltimore, MD, USA, 29 August 1999, pp.285–293.
6.
RandjelovicDJovanovVLazicZ. Vacuum MEMS sensor based on thermopiles—simple model and experimental results. In: Proceedings of 26th international conference on microelectronics MIEL 2008, vol. 2, Nis, Serbia, 11–14 May 2008, pp.367–370. MIEL.
XuDHXiongBWangY. Integrated micromachined thermopile IR detectors with an XeF2 dry-etching process. J Micromech Microeng2009; 19: 125003.
9.
MastrangeloCH. Thermal applications of microbridges. PhD Thesis, Electrical Engineering and Computer Science, University of California, Berkeley, CA1991.
10.
SantagataFIervolinoEMeleL. An analytical model and verification for MEMS Pirani gauges. J Micromech Microeng2011; 21(11): 115007.
11.
SantagataFCreemerJIervolinoE. A tube-shaped buried Pirani gauge for low detection limit with small footprint. J Microelectromech S2011; 20(3): 676–684.
12.
HuangYJChangTLChouHP. Study of symmetric microstructures for CMOS multilayer residual stress. Sensor Actuat A: Phys2009; 150: 237–242.
