Application of Mechanistic Chemical Kinetics to Thermoset Composites Processing

Abstract

Mechanistic chentical kinetics for diaminodiphenyl sulfone-cured tetra glycidyl 4,4' diaminodiphenyl methane epoxy resins have been incorporated into a composite cure model. The results are in reasonable agreement with expermental data for carbonlepoxy composite laminates from the literature. The mechanistic model is shown to be more flexible than a widely used empirical rate law, because modern formulation changes can be accommodated without re-characterizing the resin. Furthermore, the mechanistic model estimates the relative amounts of chemical linkages formed during the cure reactions. These data offer insight into the physical and chemical properties of the resin. The effects of formulation and cure cycle changes on the temperature distributions and linkage ratios are investigated through the cure model.

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