Copper (Cu) is in high demand due to its outstanding electrical and thermal conductivity. Nonetheless, its inferior mechanical properties inhibit its widespread use in industrial sectors. This experimental research analyses copper (Cu-Cu) joints formed using microwave hybrid heating (MHH). The joints are assessed by tensile strength tests, X-ray diffraction (XRD), scanning electron microscopy (SEM), and Vickers microhardness testing. Computational tools using response surface methodology (RSM) optimize the microwave joining process of metallic materials. The studies are performed with varying exposure times, particle sizes, and interface layer thicknesses with levels −1, 0, and +1. The resultant joints displayed a solid solution created by replacement inside the joint region, as seen by the XRD spectrum. Diffusion bonding occurs between the substrate and the powder particle due to the complete melting of the powder particle, as seen by the backscattered electron (BSE) images obtained from the SEM.
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