In this article bending response of the sandwich panel with functionally graded (FG) skins under thermal and/or mechanical loading is studied. Higher order sandwich plate theory has been exploited. In addition, by using Fourier conduction equation and obtaining temperature distribution, thermo-elastic behavior of such structure is investigated. Comparison between the results of analytical and FEM solutions is indicative of robustness of the analytical solution for prediction of in-plane and out-of-plane stresses. It is shown a wise selection for FG skin materials is helpful to have better conditions under thermo-mechanical loading and to decrease the delamination failure possibility.
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