Amide-containing bisnadimide (ACBI) resins were synthesized from nadic anhydride, 4-aminobenzoic acid, 4,4'-oxydianiline, and 4-nitro benzylchloride. The chemical structures were characterized using elemental analysis, FTIR and X-ray, and the thermal properties were determined using TGA. The adhesive properties of copper / ACBI composites were examined by SEM. The peel strength, heat resistance, chemical resistance, dielectric constant, and dissipation factor were measured and fund to be promising.
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