This paper introduces a new method to build a general model for estimating the critical micromilling conditions for single crystalline silicon by considering micromilling process variables based on the generally-accepted indentation model. The analytical results show that cutting edge radius and the feed rate affect the critical conditions greatly. Furthermore, the step over percentage of the cutter radius affects the critical feed rates and the machining efficiency. It shows that an appropriate cutting edge radius is the key factor to achieve high machining efficiency while ductile-regime micromilling conditions are satisfied.
DonfeldDMinSTakeuchiY. Recent advances in mechanical micromachining. Ann CIRP2006; 552(2): 745–768.
2.
MasuzawaTToenshoffHK. Three-dimensional micromachining by machine tools. Ann CIRP1997; 46(2): 621–628.
3.
MasuzawaT. State of the art of micromachining. Ann CIRP2000; 49(2): 473–488.
4.
CardosoPDavimJP. A brief review on micromachining of materials. Rev Adv Mater Sci2012; 30: 98–102.
5.
CamaraMA. Campos Rubio JC, Abrao AM, et al. State of the art on micromilling of materials: A review. J Mater Sci Technol2012; 28(8): 673–685.
6.
Li HT. Mechanism studies and process optimization of meso scale milling process. PhD Thesis, Shanghai Jiao Tong University, China, 2008.
7.
RahmanMARahmanMKumarAS. Development of micropin fabrication process using tool based micromachining. Int J Adv Manuf Technol2006; 27: 939–944.
8.
ChengXNakamotoKSugaiM. Development of ultra-precision machining system with unique wire EDM tool fabrication system for micro/nano-machining. CIRP Ann Manuf Technol2008; 57(1): 415–420.
9.
SchallerTBohnLMayerJ. Microstructure grooves with a width of less than 50 micro cut with ground hard metal micro end mills. Precis Eng1999; 23(4): 229–235.
10.
SuzukiHMoriwakiTYamamotoY. Precision cutting of a spherical ceramic molds with micro PCD milling tool. Ann CIRP2007; 56(1): 131–134.
11.
ChengXWangZGNakamotoK. Design and development of PCD micro straight edge end mills for micro/nano machining of hard and brittle materials. J Mech Sci Technol2010; 24(11): 1–8.
12.
MuhanmmadARahmanMSanWY. An experimental investigation into micro ball end-milling of silicon. J Manuf Proc2012; 14(1): 52–61.
13.
RusnaldyKoTJKimHS. An experimental study on microcutting of silicon using a micromilling machine. Int J Adv Manuf Technol2008; 39(1–2): 85–91.
14.
Nurul AminAKMKhalidNSNasirSNM. Statistical approach to modeling & optimization of surface roughness in high speed end milling of silicon with diamond coated tools. Adv Mater Res2012; 576: 28–31.
15.
FangFZWuHLiuYC. Modelling and experimental investigation on nanometric cutting of monocrystalline silicon. Int J Mach Tool Manuf2005; 45(15): 1681–1686.
16.
Cai MbLiXPRahmanM. Molecular dynamics modeling and simulation of nanoscale ductile cutting of silicon. Int J Comput Appl Technol2007; 28(1): 2–8.
17.
TanakaHShimadaSIkawaN. Brittle-ductile transition in monocrystalline silicon analysed by molecular dynamics simulation. Proc IMechE, Part C: J Mechanical Engineering Science2004; 218(6): 583–590.
18.
InanuraTTakezawaNKumakiY. Mechanics and energy dissipation in nanoscale cutting. Ann CIRP1993; 42(1): 79–82.
19.
BlakePNScattergoodRO. Ductile-regime machining of Germanium and Silicon. J Am Ceram Soc1990; 73(4): 949–957.
20.
BlackelyWSScattergoodRO. Ductile regime machining model for diamond turning of brittle materials. Precis Eng1991; 13: 95–103.
21.
Bifano TG. Ductile-regime grinding of brittle materials. PhD thesis, North Caroline State University, Raleigh, 1988.
22.
ArifMRahmanMSanWY. Analytical model to determine the critical conditions for the modes of material removal in the milling process of brittle material. J Mater Process Technol2012; 212: 1925–1933.
23.
LawnBREvansAG. A model for crack initiation in elastic/plastic indentation fields. J Mater Sci1977; 12: 2195–2199.
24.
PethicaJBHutchingsROliverWC. Hardness measurement at penetration depths as small as 20 nm. Phil Mag A1983; 48(4): 593–606.
25.
LawnB. Fracture of brittle solids, Cambridge: Cambridge University Press, 1983.
26.
GeorgeJPeterG. Microindentation analysis of di-ammonium hydrogen citrate single crystals. J Mater Sci1985; 20: 3150–3156.
27.
LawnBRMarshallDBWiederhornSM. Strength degradation of glass impacted with sharp particles-2. Tempered surfaces. J Am Ceram Soc1979; 62(1–2): 71–74.
28.
KailashCJHareeshVT. Quasi-static and dynamic fracture behavior of particulate polymer composites: A study of nano- vs. micro-size filler and loading-rate effects. Compos Part B: Eng2012; 43: 3467–3481.
29.
ChenMJDonSLiD. Study on critical condition of brittle ductile transition of brittle materials of ultra-precision grinding. High Technol Lett2000; 2(16): 67–70.
30.
Cheng X, Wang ZG, Nakamoto K, et al. Study on the micro custom PCD tooling for ductile-mode micro/nano machining of single crystal silicon. In: The 5th international conference on micromanufacturing (ICOMM/4M), Wisconsin, USA, 5–8 April 2010, pp.5–8.
31.
LiuKLiXPRahmanM. A study of the effect of tool cutting edge radius on ductile cutting of silicon wafers. Int J Adv Manuf Technol2007; 32: 631–637.
