Silicon-containing arylacetylene resins exhibit exceptional thermal stability, but their relatively high curing temperature limits their applications. To address this issue, we developed a novel dendritic silicon-containing arylacetylene (DSA) resin with silyleneethynylene-triethynylbenzene-ethynylene repeating units, which demonstrates a relatively low curing temperature. Differential scanning calorimetry (DSC) analysis indicates that the peak curing temperature of the resin is 152°C. Thermogravimetric analysis (TGA) shows that the cured resin has excellent heat resistance. The 5% thermal weight loss decomposition temperature (Td5) reaches 706°C, and the char yield at 800°C (Y800°C) is 93.9%. In addition, the DSA resin is used to lower the curing temperature of a linear silicon-containing arylacetylene (PSA) resin by blending. Compared to pure PSA resins, the peak curing temperature of the modified DSA-PSA-40 is reduced by 32°C and the heat resistance performance of the cured modified DSA-PSA resins is improved by 16°C.
HsissouRSeghiriRBenzekriZ, et al.Polymer composite materials: a comprehensive review. Compos Struct2021; 262: 113640.
2.
JinFParkSPreparation and characterization of carbon fiber-reinforced thermosetting composites: a review. Carbon Lett2015; 16: 67–77.
3.
LiJLiangJJianX, et al.A flexible and transparent thin film heater based on a silver nanowire/heat-resistant polymer composite. Macromol Mater Eng2014; 299: 1403–1409.
4.
WangCHuangFJiangY, et al.A novel oxidation resistant SiC/B4C/C nanocomposite derived from a carborane‐containing conjugated polycarbosilane. J Am Ceram Soc2012; 95: 71–74.
5.
ZhangJHuangJDuW, et al.Thermal stability of the copolymers of silicon-containing arylacetylene resin and acetylene-functional benzoxazine. Polym Degrad Stabil2011; 96: 2276–2283.
6.
WangCZhouYHuangF, et al.Synthesis and characterization of thermo-oxidatively stable poly (dimethylsilyleneethynylenephenyleneethynylene) with o-carborane units. React Funct Polym2011; 71: 899–904.
7.
XuJWangCLaiG, et al.“Synthesis and characterization of phenylacetylene-terminated poly (silyleneethynylene-4, 4'-phenylethereneethynylene)s”. Eur Polym J2007; 43: 668–672.
8.
BrefortJCorriuRGerbierP, et al.New poly [(silylene) diacetylenes] and poly [(germylene) diacetylenes]: synthesis and conductive properties. Organometallics1992; 11: 2500–2506.
9.
WengZHuYQiY, et al.Enhanced properties of phthalonitrile resins under lower curing temperature via complex curing agent. Polym Adv Technol2020; 31: 233–239.
10.
NaHYeomHYoonB, et al.Cure behavior and chemorheology of low temperature cure epoxy matrix resin. Polymer (Korea)2014; 38: 171–179.
11.
TianJWanLHuangJ, et al.Synthesis and characterization of a novel polytriazole resin with low-temperature curing character. Polym Adv Technol2007; 18: 556–561.
12.
DaiSZhuoDGuA, et al.A novel hybrid catalyst system and its effects on the curing, thermal, and dielectric properties of cyanate ester. Polym Eng Sci2011; 51: 2236–2244.
13.
LiuZHuangYDengSSynthesis and characterization of thermosetting polyacetylene-terminated silicone resins. Polym Eng Sci2020; 137: 48783.
14.
LuLGuoKZhuJ, et al.Silicon-containing fluorenylacetylene resins with low curing temperature and high thermal stability. J Appl Polym Sci2019; 136: 48262.
15.
HanMGuoKWangF, et al.Synthesis, characterization, and properties of thermosets based on the cocuring of an acetylene-terminated liquid-crystal and silicon-containing arylacetylene oligomer. J Appl Polym Sci2017; 134: 45141.
16.
ShenYYuanQHuangF, et al.Effect of neutral nickel catalyst on cure process of silicon-containing polyarylacetylene. Thermochim Acta2014; 590: 66–72.
17.
TsengWChenYChangGCuring conditions of polyarylacetylene prepolymers to obtain thermally resistant materials. Polym Degrad Stabil2009; 94: 2149–2156.
18.
ZhouJLiuZHengZ, et al.Utilizing the “Dangling Group Effect” caused by the cross-linked network topology transformation to prepare high-performance and deformable resins and composites. Macromolecules2021; 54: 8894–8903.
19.
ReungdechWTachaboonyakiatWFunctionalization of polylactide with multibranched poly(ethyleneimine) by in situ reactive extrusion. Polymer2022; 246: 124746.
20.
SikderAPearceAKKumarCMS, et al.Elucidating the role of multivalency, shape, size and functional group density on antibacterial activity of diversified supramolecular nanostructures enabled by templated assembly. Mater Horiz2023; 10: 171–178.
21.
DaiNTangJMaM, et al.Star-shaped arylacetylene resins derived from silicon. J Polym Eng2009; 40: 676–684.
22.
LapienisGStar-shaped polymers having PEO arms. Prog Polym Sci2009; 34: 852–892.
23.
BlencoweATanJFGohTK, et al.Core cross-linked star polymers via controlled radical polymerisation. Polymer2009; 50: 5–32.
24.
HuangYDengSLiuZ. Star-shaped silicon-containing arylacetylene resin based on a one-pot synthesis using zinc powder catalysis with improved processing and thermal properties. J Appl Polym Sci. 2019; 136: 48248.
25.
XiaoJJiangDWuX, et al.Carbene-induced ring-opening reactions of five-/six-membered cyclic ethers: expanding the frontiers of functional group introduction and molecular architecture construction. Org Biomol Chem2025; 23: 2024–2040.
26.
LingZZhuJCaiC, et al.Highly heat-resistant branched silicon-containing arylacetylene resins with low curing temperature. Polym Int2021; 70: 1595–1603.
27.
WangZLiuXHanY, et al.Preparation and characterization of phthalonitrile resin within hyperbranched structure. High Perform Polym2020; 32: 963–972.
28.
LvSGongCWangC, et al.Heat-resistant dendritic poly(methylsilane arylacetylene) with attractive mechanical properties enhanced via higher curing temperature. ACS Appl Polym Mater2024; 6: 8651–8658.
29.
LiJGongCLvS, et al. High‐performance poly(methylsilane arylether arylacetylene) resins with low curing temperatures and weak secondary relaxations. J Appl Polym Sci. 2023; 141(5): e54875.
30.
ZhuJChuMChenZ, et al.Rational design of heat-resistant polymers with low curing energies by a materials genome approach. Chem Mater2020; 32: 4527–4535.
31.
GaoGZhangSWangL, et al.Developing highly tough, heat-resistant blend thermosets based on silicon-containing arylacetylene: a material genome approach. ACS Appl Mater Interfaces2020; 12: 27587–27597.
32.
ChuMZhuJWangL, et al.Accelerating the design and synthesis of heat-resistant silicon-containing arylacetylene resins by a material genome approach. Acta Polym Sin2019; 50: 1211–1219.
33.
ZhuMLiuJGanL, et al.Research progress in bio-based self-healing materials. Eur Polym J2020; 129: 109651.
34.
LiCLuoJMaM, et al.Synthesis and properties of sulfur-contained poly (silylene arylacetylene)s. Eur Polym J2019; 57: 2324–2332.
35.
CaiMYuanQHuangFCatalytic effect of poly (silicon-containing arylacetylene) with terminal acetylene on the curing reaction and properties of a bisphenol A type cyanate ester. Polym Int2018; 67: 1563–1571.
36.
OzawaT. Non-isothermal kinetics and generalized time. Thermochim Acta1986; 100: 109–118.
37.
KissingerHReaction kinetics in differential thermal analysis. Anal Chem1957; 29: 1702–1706.
38.
ChenHXinHLuJ, et al.Synthesis and properties of poly (dimethylsilylene-ethynylene-phenoxyphenoxyphenylene-ethynylene). High Perform Polym2017; 29: 595–601.
39.
WangFZhangJHuangJ, et al.Synthesis and characterization of poly (dimethylsilylene ethynylenephenyleneethynylene) terminated with phenylacetylene. Polym Bull2006; 56: 19–26.
40.
GuoKLiPZhuY, et al.Thermal curing and degradation behaviour of silicon-containing arylacetylene resins. Polym Degrad Stabil2016; 131: 98–105.
41.
ChenMLiuCLinJCorrelation of cross-linked structures and properties in the characterization of dimethyl-diphenylethynyl-silane using DSC, TGA and Py-GC/MS analysis. Polym Degrad Stabil2015; 112: 35–42.
42.
ZhangSDuSWangL, et al.Design of silicon-containing arylacetylene resins aided by machine learning enhanced materials genome approach. Chem Eng J2022; 448: 137643.
43.
HeJLiLZhouJ, et al.Ultra-high modulus epoxy resin reinforced by intensive hydrogen bond network: from design, synthesis, mechanism to applications. Compos Sci Technol2023; 231: 109815.
