Sage Journals: Discover world-class research

Abstract

Coir dust reinforced polymer composites are prepared with epoxy resin as the matrix. The dielectric parameters (relative permittivity ε′, dielectric loss ε′′), AC conductivity σ, and resistivity ρ of pure epoxy resin and composites with different weight percent of coir dust were obtained in a frequency range of 100 Hz to 1 MHz, and temperature range of 30—150°C. The experimental results show that ε′, ε′′, and σ are increased and ρ is decreased with the addition of coir dust in epoxy resin. It is also observed that the dielectrical properties of the composites showed a strong dependence on frequency and temperature. The ε′ and ε′′ increases with increasing temperature because of greater movement of the dipole molecular chains and decreases with increasing frequency due to the orientation polarization. The conductivity of the composite is increased, and the resistivity of composite is decreased with increasing frequency.

Keywords

Composite materials orientation polarization dielectric loss conductivity resistivity dielectric relaxation epoxy resin

Get full access to this article

View all access options for this article.

References

Arebelaiz A. , Fernadez B. , Cantero G. , LanoPonte R. , Vlela A. and Monfragon I. Mechanical properties of flax fibre/ polypropylene composites. Influence of fibre/matrix modification and glass fibre hybridization . Compos Part A- Appl Sci Manufac 2005; 36: 1637-1644.

Pothan LA , Oommen Z. and Thomas S. Mechanical properties of glass/palmyra fiber waste sandwich composites. Compos Sci Technol 2003; 63: 283-293.

Wang W. , Sain M. and Cooper PA Study of moisture absorption in natural fiber plastic composites. Compos Sci Technol 2006; 66: 379-386.

Aoi N. Novel porous films having low dielectric constants synthesized by liquid phase silylation of spin-on glass sol for intermetal dielectrics. Jpn J Appl Phys 1997; 36: 1355-1359.

Wu W. , Waiiace WE , Lin EK , Lynn GW , Glinka CJ , Ryan ET , et al. Properties of nanoporous silica thin films determined by high-resolution x-ray reflectivity and small-angle neutron scattering. J Appl Phys 2000; 87:1193.

Jo HM , Park HH , Kim DJ , Hyun SH , Choi SY and Paik JT SiO2 aerogel film as a novel intermetal dielectric. J Appl Phys 1997; 82: 1299.

Taylor S. Bullers of Milton. UK: Churnet Valley Books, 2003.

Denson DR , Barbour JC and Burkart JH Low dielectric constant, fluorine doped SiO2 for intermetal dielectric. Vac Sci Technol 1996; 14: 1124.

Tada M. , Harada Y. , Hijioka K. , Ohtake H. , Takeuchi T. , Saito S. , et al. ‘Cu dual damascene interconnects in porous organosilica film with organic hard-mask and etch-stop layers for 70 nm-node ULSIs’ . In: Interconnect Technology Conference, 2002, Proceedings of the IEEE 2002 International, Hyatt Regency Hotel, Burlingame, CA, USA, June 3-5, pp.12-14.

10.

Ben Amor I. , Rekik H. , Kaddami H. , Raihane M. , Arous M. and Kallel A. Studies of dielectric relaxation in natural fiber-polymer composites. J Electrostat 2009 ; 67: 717-722.

11.

Awan EH and Shamim A. Dielectric properties of novel polyster composite material. JNSMAC 2007; 47:25-32.

12.

Akram M. , Javed A. and Rizvi TZ Dielectric properties of industrial polymer composite materials. Turk J Phys 2005; 29: 355-365.

13.

Frohlic H. Theory of dielectrics. Oxford: Oxford University Press, 1956, p.13.

14.

Smyth CP Dielectric behaviour and structure. New York: McGraw Hill, 1995.

Evaluation of dielectric behavior of bio-waste reinforced polymer composite

Abstract

Keywords

Get full access to this article

References