MaedaS., “Mite wakaru Komitsudo Jisso Gijutsu”, Kogyochosakai, Tokyo (2003).
2.
KakiuchiH. Ed., “Epoxy Jushi Kokazai no Shintenkai”, CMC, Tokyo (1994).
3.
HondaS., InokumaT., KawamataA., SamutaY. Eds., “Komitsudo Jisso Handbook”Science Forum (1986).
4.
KyokaiGijutsu Joho Ed., “Epoxy Jushi no Koseinouka to Kokazai no Haigogijutsu oyobiHyoka/Oyo, Tokyo (1997).
5.
MatsunagaK., “Polyurethane no Kiso to Oyo”, CMC, Tokyo (2006).
6.
NakanishiT., ShundohY., KuboyamaT., OhkumaH., “Optimization Study on Underfill for High Density Packaging with Numerical Analysis” (The 13th IEEE International Symposium on Consumer Electronics, 25-28th, May, 2009, Kyoto, Japan).