Abstract
Get full access to this article
View all access options for this article.
References
1.
Marx P.
, Schutz and Trutz: The use of light-hardening adhesives in electronics. KEM 9 (1996 ), pp 77 –79
2.
Messmer R.
,
Riege R.
: Light-hardening adhesives with new possibilities. Adhäsion 37 (1993 ), pp 24 –29
3.
Leopold D.
: Bonding in electronics. Kleben & Dichten 39 (1995 ) pp 20 –24
4.
Bittmann E.
,
Ehrenstein G.W.
: UV curing epoxy resins into microchip covering, Plaste und Kautschuk 41 (1994 ), pp 126 –220
5.
Gleich H
: Improving wettability by plasma treatment. Kleben & Dichten 33 (1989 ), pp 9 –15
6.
Neumann A.W.
: Spelt, J.K. Applied Surface Thermodynamics Marcel Dekker New York 1996
7.
Ehrenstein G.W.
: Constructing with adhesives. 2nd edition. Carl Hanser Verlag, Munich, 2001