Ag-coated Cu particles prepared by electroless deposition are highly anticipated bimetallic materials with wide electronic applications. However, only limited progress has been made in the kinetics and mechanism of chemical silver deposition on copper particles. A series of Ag-coated copper particles with uniform and continuous silver coverings were successfully prepared by varying the reaction temperature. The study used the Johnson-Mehl-Avrami model to conduct kinetic analyses, revealed the nucleation and growth mechanisms and yielded corresponding kinetic parameters. The temperature was found to have a proportional correlation with the reaction rate constant (k), with an activation energy of approximately 10.01 kJ/mol. These particles exhibit exceptional oxidation resistance. Moreover, the particles were used to develop a new conductive paste with high electrical conductivity.
IslakS. Mechanical and corrosion properties of AlCu matrix hybrid composite materials. Sci Sintering2019; 51: 81–92.
3.
KumarNBhartiADixitM, et al.Effect of powder metallurgy process and its parameters on the mechanical and electrical properties of copper-based materials: literature review. Powder Metall Met Ceram2020; 59: 401–410.
4.
LiQJunYS. The apparent activation energy and pre-exponential kinetic factor for heterogeneous calcium carbonate nucleation on quartz. Commun Chem2018; 1: 56.
5.
SadounAMFathyA. Experimental study on tribological properties of Cu–Al2O3 nanocomposite hybridized by graphene nanoplatelets. Ceram Int2019; 45: 24784–24792.
6.
SadounAMFathyAOqailAA, et al.Structural, mechanical and tribological properties of Cu–ZrO2/GNPs hybrid nanocomposites. Ceram Int2020; 46: 7586–7594.
7.
ParkBKKimDJeongS, et al.Direct writing of copper conductive patterns by ink-jet printing. Thin Solid Films2007; 515: 7706–7711.
8.
LeeYChoiJLeeKJ, et al.Large-scale synthesis of copper nanoparticles by chemically controlled reduction for applications of inkjet-printed electronics. Nanotechnology2008; 19: 415604.
9.
LuechingerNAAthanassiouEKStarkWJ. Graphene-stabilized copper nanoparticles as an air-stable substitute for silver and gold in low-cost ink-jet printable electronics. Nanotechnology2008; 19: 445201.
10.
AthanassiouEKGrassRNStarkWJ. Large-scale production of carbon-coated copper nanoparticles for sensor applications. Nanotechnology2006; 17: 1668–1673.
11.
RanuBCSahaAJanaR. Microwave-Assisted simple and efficient ligand free copper nanoparticle catalyzed aryl-sulfur bond formation. Adv Synth Catal2007; 349: 2690–2696.
12.
SarkarAMukherjeeTKapoorS. PVP-Stabilized copper nanoparticles: a reusable catalyst for “click” reaction between terminal alkynes and azides in nonaqueous solvents. J Phys Chem C2008; 112: 3334–3340.
13.
MagdassiSGrouchkoMKamyshnyA. Copper nanoparticles for printed electronics: routes towards achieving oxidation stability. Materials (Basel)2010; 3: 4626–4638.
14.
GülerOAlverÜVarolT. Fabrication and characterization of novel layered materials produced by electroless plating and hot pressing. J Alloys Compd2020; 835: 155278.
15.
AbudabbusMMJevremovićINešovićK, et al.In situ electrochemical synthesis of silver-doped poly(vinyl alcohol)/graphene composite hydrogels and their physico-chemical and thermal properties. Compos B2018; 140: 99–107.
16.
TempleDReismanA. Chemical vapor deposition of copper from copper (II) hexafluoroacetylacetonate. J Electrochem Soc1989; 136: 3525–3529.
17.
IslamMThakurMSHMojumderS, et al.Mechanical and vibrational characteristics of functionally graded Cu–Ni nanowire: a molecular dynamics study. Compos B2020; 198: 108212.
18.
ZhangJZhanPLiuH, et al.A facile colloidal templating method to monodisperse hollow Ag and Ag/Au submicrometer spheres. Mater Lett2006; 60: 280–283.
19.
GülerOVarolTAlverÜ, et al.Effect of Al2O3 content and milling time on the properties of silver coated Cu matrix composites fabricated by electroless plating and hot pressing. Mater Today Commun2020; 24: 101153.
20.
SchaefersSRastLStanishevskyA. Electroless silver plating on spin-coated silver nanoparticle seed layers. Mater Lett2006; 60: 706–709.
21.
LiJMayerJWColganEG. Oxidation and protection in copper and copper alloy thin films. J Appl Phys1991; 70: 2820–2827.
22.
XuXLuoXZhuangH, et al.Electroless silver coating on fine copper powder and its effects on oxidation resistance. Mater Lett2003; 57: 3987–3991.
23.
CaoXGZhangHY. Preparation of silver-coated copper powder and its oxidation resistance research. Powder Technol2012; 226: 53–56.
24.
ZhouYHuoY. The comparison of electrochemical migration mechanism between electroless silver plating and silver electroplating. J Mater Sci: Mater Electron2015; 27: 931–941.
25.
LiWHuDLiL, et al.Printable and flexible copper-silver alloy electrodes with high conductivity and ultrahigh oxidation resistance. ACS Appl Mater Interfaces2017; 9: 24711–24721.
26.
GülerOVarolTAlverÜ, et al.The effect of flake-like morphology on the coating properties of silver coated copper particles fabricated by electroless plating. J Alloys Compd2019; 782: 679–688.
27.
AntonelloAJiaBHeZ, et al.Optimized electroless silver coating for optical and plasmonic applications. Plasmonics2012; 7: 633–639.
28.
KanekoKYamamotoKKawataS, et al.Metal-nanoshelled three-dimensional photonic lattices. Opt Lett2008; 33: 1999–2001.
29.
TsaiCHChenSYSongJM, et al.Thermal stability of Cu@Ag core–shell nanoparticles. Corros Sci2013; 74: 123–129.
30.
SompechSThaomolaSChingsungnoenA, et al.Theoretical calculation of optical absorption property of Cu@Ag core–shell composite nanoparticle. Mater Res Express2018; 6. Https://doi.org/10.1088/2053-1591/aaeb58
31.
KimSJStachEAHandwerkerCA. Fabrication of conductive interconnects by Ag migration in Cu–Ag core-shell nanoparticles. Appl Phys Lett2010; 96. Https://doi.org/10.1063/1.3364132
32.
HuangYWuFZhouZ, et al.Fabrication of fully covered Cu-Ag core-shell nanoparticles by compound method and anti-oxidation performance. Nanotechnology2020; 31: 175601. Https://doi.org/10.1088/1361-6528/ab68b9
33.
MaYGuoLQiL, et al.Growth mechanism and thermal behavior of electroless Cu plating on short carbon fibers. Surf Coat Technol2021; 419: 127294.
34.
DaiGWuSHuangX, et al.Research on the coating formation of Al-induced electroless plating on metallic surfaces. J Mater Sci2023; 58: 3768–3789.
35.
ZhangJLiuSLiuJ, et al.Electroless nickel plating and spontaneous infiltration behavior of woven carbon fibers. Mater Des2020; 186: 108301.
36.
XueYChenWZhaoQ, et al.Electroless carbon fibers: a new route for improving mechanical property and wettability of composites. Surf Coat Technol2019; 358: 409–415.
37.
AvramiM. Kinetics of phase change. I general theory. J Chem Phys1939; 7: 1103–1112.
38.
AvramiM. Kinetics of phase change. II transformation-time relations for random distribution of nuclei. J Chem Phys1940; 8: 212–224.
39.
AvramiM. Granulation, phase change, and microstructure kinetics of phase change. III. J Chem Phys1941; 9: 177–184.
40.
NagyTTurányiT. Uncertainty of Arrhenius parameters. Int J Chem Kinet2011; 43: 359–378.
41.
RochaDNdSilvaMHPdCamposJBd, et al.Kinetics of conversion of brushite coatings to hydroxyapatite in alkaline solution. J Mater Res Technol2018; 7: 479–486.
42.
LiuCHuangYShenW, et al.Kinetics of hydroxyapatite precipitation at pH 10 to 11. Biomaterials2001; 22: 301–306.
43.
HoCMYauSKLokC, et al.Oxidative dissolution of silver nanoparticles by biologically relevant oxidants: a kinetic and mechanistic study. Chem Asian J2010; 5: 285–293.
44.
JiménezJASendovaMMcAlpineK. Revealing oxidation kinetics of dielectric-embedded Ag nanoparticles via in situ optical microspectroscopy. Chem Phys Lett2012; 523: 107–112.
45.
WangZMYinBZhangL, et al.Preparation of superfine spherical silver powders for solar cell silver paste via non-wetting effect of the liquid/solid interface. J Electron Mater2024; 53: 606–611.
