This study focuses on the fabrication of thermal management material for power electronics applications using graphite flake reinforced copper composites. The effects of mixing, die-filling, and particle size of copper on microstructure and thermal conductivity of the composites were investigated. The results indicate that the process, especially die-filling, affects the distribution and orientation of graphite flake and then affects the relative density and thermal conductivity of the composites. The graphite flake/copper composites with 20–50 vol. % flakes have relatively high density of over 98%. The composites show a strong anisotropy in thermal conductivity and have a value of 528 W·m−1·K−1 with 40 vol. % graphite flakes at room temperature in the direction perpendicular to the pressing direction, which exhibit excellent thermo-physical properties to meet the heat dispersion and matching requirements of power electronic devices to the packaging materials.
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